NXP Producten

BC557C,112

NXP

TRANS PNP 45V 0.1A TO-92

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
• Current - Collector Cutoff (Max): 15nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
• Power - Max: 500mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

package: TO-226-3, TO-92-3 (TO-226AA)

BB202,115

NXP

DIODE VAR CAP 6V SOD-523

• Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
• Capacitance Ratio: 2.5
• Capacitance Ratio Condition: C0.2/C2.3
• Voltage - Peak Reverse (Max): 6V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

package: SC-79, SOD-523

MC33909N5ADR2

NXP

SBC SG 1 CAN 0 LIN HLQFP48

• Applications: System Basis Chip
• Current - Supply: 7mA
• Voltage - Supply: 3.5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

MC44BC375UAEFR2

NXP

IC A-VHF MODULATOR 16-SOIC

• Type: Modulator
• Applications: Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.154", 3.90mm Width)

M86262G12

NXP

IC C2K 650MHZ 8CH VOIP 625BGA

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

MC8640VU1000HE

NXP

IC MPU MPC86XX 1.0GHZ 994FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

package: 994-BCBGA, FCCBGA

MPC8264AZUPIBB

NXP

IC MPU MPC82XX 300MHZ 408TBGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 300MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

package: 480-LBGA

MPC8536CVJAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

P80C552EFB/08,557

NXP

IC MCU 8BIT ROMLESS 80QFP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, I2C, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-BQFP
• Supplier Device Package: 80-PQFP (14x20)

package: 80-BQFP

LPC2106FHN48/01,55

NXP

IC MCU 32BIT 128KB FLASH 48HVQFN

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

package: 48-VFQFN Exposed Pad

MC9S08PT16AVLC

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MKL27Z256VFM4

NXP

IC MCU 32BIT 256KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART, USB
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-UFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

package: 32-UFQFN Exposed Pad

ADC0801S040TS/C1:1

NXP

IC ADC 8BIT PAR 40MHZ 20-SSOP

• Number of Bits: 8
• Sampling Rate (Per Second): 10k
• Number of Inputs: 1
• Input Type: Differential
• Data Interface: Parallel
• Configuration: ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: SAR
• Reference Type: External, Supply
• Voltage - Supply, Analog: 4.5 V ~ 6.3 V
• Voltage - Supply, Digital: 4.5 V ~ 6.3 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSOP
• Mounting Type: -

package: 20-LSSOP (0.173", 4.40mm Width)

UDA1330ATS/N2,112

NXP

IC AUDIO DAC STEREO 16-SSOP

• Type: DAC, Audio
• Number of Channels: -
• Resolution (Bits): 20 b
• Sampling Rate (Per Second): 55k
• Data Interface: I2S
• Voltage Supply Source: Analog and Digital
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-SSOP

package: 16-LSSOP (0.173", 4.40mm Width)

MPXV7025GC6T1

NXP

SENSOR PRESSURE AXIAL PORT 8-SMD

• Pressure Type: Compound
• Operating Pressure: ±3.63 PSI (±25 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.18mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: ±29.01 PSI (±200 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD, Gull Wing, Top Port
• Supplier Device Package: -

package: 8-SMD, Gull Wing, Top Port

MPXV5100GC7U

NXP

PRESSURE SENSOR SILICON 8-DIP

• Pressure Type: Vented Gauge
• Operating Pressure: 14.5 PSI (100 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±2.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DIP (0.550", 13.97mm), Top Port
• Supplier Device Package: 8-DIP

package: 8-DIP (0.550", 13.97mm), Top Port

TEF6901AH/V3,518

NXP

IC INTEGRATED CAR RADIO 64-QFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Current - Receiving: 102mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 8 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-BQFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-BQFP

SA601DK,112

NXP

IC MIXER LNA 1GHZ 20SSOP

• RF Type: -
• Frequency: 1GHz
• Number of Mixers: 1
• Gain: 11.5dB
• Noise Figure: 1.6dB
• Secondary Attributes: -
• Current - Supply: 7.4mA
• Voltage - Supply: 2.7 V ~ 5.5 V
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSOP

package: 20-LSSOP (0.173", 4.40mm Width)

LS1088ASE7Q1A

NXP

LS1088A 1600/2100 WE RVA

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

FS32K144UFT0CLLT

NXP

S32K144 32-BIT MCU, ARM

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

SPC5742PFK1AMLQ9

NXP

1.5MB NVM 2 X E200Z4 CORES 200

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 200MHz
• Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: -
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

S912XEQ384BMAL

NXP

16-BIT MCU S12X CORE 384KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MKS22FN128VLL12

NXP

KINETIS S 32-BIT MCU ARM CORTEX

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, I²C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 1x16b. D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MC56F83763VLHR

NXP

IC

• Type: DSP
• Interface: CANbus, SCI, SPI
• Clock Rate: 100MHz
• Non-Volatile Memory: FLASH (128kB)
• On-Chip RAM: 48kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: -

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LPC55S28JBD64K

NXP

IC MCU 32BIT 512KB FLASH 64HTQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 36
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

package: -

PCA9420BSAZ

NXP

PCA9420BS

• Applications: -
• Current - Supply: 4.5µA
• Voltage - Supply: 3.3V ~ 5.5V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (3x3)

package: -

FG32K144HFT0MLLT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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CLF1G0035-100P

NXP

RF MOSFET HEMT 50V LDMOST

• Transistor Type: HEMT
• Frequency: 3.5GHz
• Gain: 12.5dB
• Voltage - Test: 50 V
• Current Rating: -
• Noise Figure: -
• Current - Test: 330 mA
• Power - Output: 100W
• Voltage - Rated: 150 V
• Package / Case: SOT-1228A
• Supplier Device Package: LDMOST

package: -

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