Pagina 43 - NXP Producten - Embedded - Microcontrollers

S32K344EHT1MMMST

NXP

LOCKSTEP CORE M7, 160MHZ, 4M FLA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Number of I/O: 218
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Supplier Device Package: 257-LFBGA (14x14)

package: -

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32-Bit

160MHz

CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART

DMA, I2S, Serial Audio, WDT

218

4MB (4M x 8)

FLASH

-

512K x 8

2.7V ~ 5.5V

A/D 24x12b

Internal

-40°C ~ 125°C

Surface Mount

257-LFBGA

257-LFBGA (14x14)

MKM33Z64ACLH5R

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Number of I/O: 38
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 6x16b, 24b SAR, Sigma; D/A 4x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

package: -

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32-Bit Single-Core

50MHz

I2C, SPI, UART/USART

DMA, LCD, WDT

38

64KB (64K x 8)

FLASH

-

16K x 8

1.71V ~ 3.6V

A/D 6x16b, 24b SAR, Sigma; D/A 4x6b

Internal

-40°C ~ 85°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

MC56F8036VLFR

NXP

IC MCU 16BIT

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

package: -

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-

MC56F8323VFBER

NXP

IC MCU 16BIT 32KB FLASH 64LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 60MHz
Connectivity: CANbus, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Number of I/O: 27
Program Memory Size: 32KB (16K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

package: -

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16-Bit

60MHz

CANbus, SCI, SPI

POR, PWM, Temp Sensor, WDT

27

32KB (16K x 16)

FLASH

-

12K x 8

3V ~ 3.6V

A/D 8x12b

Internal

-40°C ~ 105°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

S32K344EHT1VPBSR

NXP

IC

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: 142
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 172-QFP
Supplier Device Package: 172-QFP (16x16)

package: -

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32-Bit Dual-Core

160MHz

CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART

DMA, I2S, WDT

142

4MB (4M x 8)

FLASH

128K x 8

512K x 8

2.97V ~ 5.5V

A/D 24x12b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

172-QFP

172-QFP (16x16)

S32K344EHT1VPBST

NXP

IC MCU 32BIT 4MB FLASH 172QFP

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINBus, SPI, QSPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Number of I/O: 218
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 172-QFP
Supplier Device Package: 172-QFP (16x16)

package: -

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32-Bit

160MHz

CANbus, Ethernet, FlexIO, I2C, LINBus, SPI, QSPI, UART/USART

DMA, I2S, Serial Audio, WDT

218

4MB (4M x 8)

FLASH

-

512K x 8

2.7V ~ 5.5V

A/D 24x12b

Internal

-40°C ~ 105°C

Surface Mount

172-QFP

172-QFP (16x16)

SPC5746CFK1AMKU6

NXP

IC MCU 32BIT 3MB FLASH 176LQFP

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz, 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Number of I/O: 129
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 68x10b, 31x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

package: -

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32-Bit Dual-Core

80MHz, 160MHz

CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI

DMA, I2S, LVD/HVD, POR, WDT

129

3MB (3M x 8)

FLASH

128K x 8

384K x 8

3.15V ~ 5.5V

A/D 68x10b, 31x12b SAR

Internal

-40°C ~ 125°C (TA)

Surface Mount

176-LQFP Exposed Pad

176-LQFP (24x24)

S32K342NHT0VPBSR

NXP

IC MCU

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

package: -

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-

S32K342NHT0VPBST

NXP

S32K342, 2MB FLASH, 256KB RAM

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: 143
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 172-QFP
Supplier Device Package: 172-QFP (16x16)

package: -

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32-Bit

160MHz

CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART

DMA, I2S, WDT

143

2MB (2M x 8)

FLASH

128K x 8

256K x 8

2.97V ~ 5.5V

A/D 24x12b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

172-QFP

172-QFP (16x16)

MIMXRT1172AVM8A

NXP

IC MCU 32BIT EXT MEM 289MAPBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 800MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O: 13
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 2M x 8
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Data Converters: A/D 20x12b SAR; D/A 1x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Supplier Device Package: 289-LFBGA (14x14)

package: -

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32-Bit Single-Core

800MHz

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG

Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT

13

-

External Program Memory

-

2M x 8

1.65V ~ 1.95V, 3V ~ 3.6V

A/D 20x12b SAR; D/A 1x12b

External, Internal

-40°C ~ 125°C (TJ)

Surface Mount

289-LFBGA

289-LFBGA (14x14)

S912ZVML32AMKH

NXP

S12Z CORE, 32K FLASH, LIN, 64LQF

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 24
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 9x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-HLQFP (10x10)

package: -

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16-Bit

50MHz

CANbus, SCI, SPI

DMA, POR, PWM, WDT

24

32KB (32K x 8)

FLASH

512 x 8

4K x 8

3.5V ~ 40V

A/D 9x12b SAR

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

64-LQFP Exposed Pad

64-HLQFP (10x10)

LPC1758FBD80-P1K

NXP

SCALABLE MAINSTREAM 32-BIT MICRO

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 52
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Data Converters: A/D 6x12b SAR; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

package: -

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32-Bit

100MHz

CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

52

512KB (512K x 8)

FLASH

-

64K x 8

2.4V ~ 3.6V

A/D 6x12b SAR; D/A 1x10b

Internal

-40°C ~ 85°C (TA)

Surface Mount

80-LQFP

80-LQFP (12x12)

MIMXRT1061CVJ5BR

NXP

IC MCU 32BIT EXT MEM 196LFBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 528MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 127
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 20x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Supplier Device Package: 196-LFBGA (12x12)

package: -

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32-Bit Single-Core

528MHz

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG

Brown-out Detect/Reset, DMA, POR, PWM, WDT

127

-

External Program Memory

-

1M x 8

3V ~ 3.6V

A/D 20x12b

External, Internal

-40°C ~ 105°C (TJ)

Surface Mount

196-LFBGA

196-LFBGA (12x12)

MC9S08PB8MTJ

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

package: -

Voorraad2.325

8-Bit

20MHz

I2C, LINbus, SPI, UART/USART

LVD, POR, PWM, WDT

18

8KB (8K x 8)

FLASH

-

1K x 8

2.7V ~ 5.5V

A/D 12x12b

External

-40°C ~ 125°C (TA)

Surface Mount

20-TSSOP (0.173", 4.40mm Width)

20-TSSOP

S912ZVLA64F0VLCR

NXP

IC MCU 16BIT 64KB FLASH 32LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 19
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 6x10b, 6x12b; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

package: -

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16-Bit

32MHz

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

DMA, LVD, POR, PWM, WDT

19

64KB (64K x 8)

FLASH

1K x 8

4K x 8

5.5V ~ 18V

A/D 6x10b, 6x12b; D/A1x8b

Internal

-40°C ~ 105°C (TA)

Surface Mount

32-LQFP

32-LQFP (7x7)

SPC5606BAVLU6R

NXP

NXP 32-BIT MCU, POWER ARCH CORE

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

package: -

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-

S9S12GA64J0MLF

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

package: -

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16-Bit

25MHz

CANbus, IrDA, LINbus, SCI, SPI

LVD, POR, PWM, WDT

40

64KB (64K x 8)

FLASH

2K x 8

4K x 8

3.13V ~ 5.5V

A/D 12x12b

Internal

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP

48-LQFP (7x7)

LPC5514JBD64E

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

package: -

Voorraad435

32-Bit Single-Core

150MHz

CAN FD, Flexcomm, I2C, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

36

128KB (128K x 8)

FLASH

-

80K x 8

1.8V ~ 3.6V

A/D 10x16b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-TQFP Exposed Pad

64-HTQFP (10x10)

LPC5514JBD64K

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

package: -

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32-Bit Single-Core

150MHz

CAN FD, Flexcomm, I2C, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

36

128KB (128K x 8)

FLASH

-

80K x 8

1.8V ~ 3.6V

A/D 10x16b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-TQFP Exposed Pad

64-HTQFP (10x10)

LPC5514JBD64Y

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

package: -

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32-Bit Single-Core

150MHz

CAN FD, Flexcomm, I2C, SPI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT

36

128KB (128K x 8)

FLASH

-

80K x 8

1.8V ~ 3.6V

A/D 10x16b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-TQFP Exposed Pad

64-HTQFP (10x10)

FS32K116LFT0MFMR

NXP

IC MCU 32BIT 128KB FLASH 32HVQFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 48MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Number of I/O: 28
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 17K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 13x12b SAR; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

package: -

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32-Bit Single-Core

48MHz

CANbus, FlexIO, I2C, LINbus, SPI, UART/USART

DMA, PWM, WDT

28

128KB (128K x 8)

FLASH

2K x 8

17K x 8

2.7V ~ 5.5V

A/D 13x12b SAR; D/A 1x8b

Internal

-40°C ~ 125°C (TA)

Surface Mount

32-VFQFN Exposed Pad

32-HVQFN (5x5)

FS32K116LFT0MFMT

NXP

IC MCU 32BIT 128KB FLASH 32HVQFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 48MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Number of I/O: 28
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 17K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 13x12b SAR; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

package: -

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32-Bit Single-Core

48MHz

CANbus, FlexIO, I2C, LINbus, SPI, UART/USART

DMA, PWM, WDT

28

128KB (128K x 8)

FLASH

2K x 8

17K x 8

2.7V ~ 5.5V

A/D 13x12b SAR; D/A 1x8b

Internal

-40°C ~ 125°C (TA)

Surface Mount

32-VFQFN Exposed Pad

32-HVQFN (5x5)

LPC54S018JET180K

NXP

IC MCU 32BIT ROMLESS 180TFBGA

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit Single-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 145
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 16K x 8
RAM Size: 360K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

package: -

Voorraad2.835

32-Bit Single-Core

180MHz

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT

145

-

ROMless

16K x 8

360K x 8

1.71V ~ 3.6V

A/D 12x12b SAR

Internal

-40°C ~ 105°C (TA)

Surface Mount

180-TFBGA

180-TFBGA (12x12)

FG32K118LFT0MLHR

NXP

IC

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

package: -

Request a Quote

-

FG32K118LFT0MLHT

NXP

S32K118, M0+, FLASH 256K, RAM 25

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

package: -

Request a Quote

-

LPC54S018JET180Y

NXP

POWER-EFFICIENT MICROCONTROLLERS

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 145
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 360K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

package: -

Request a Quote

32-Bit

180MHz

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB

Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT

145

-

ROMless

-

360K x 8

1.71V ~ 3.6V

A/D 12x12b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

180-TFBGA

180-TFBGA (12x12)

S912ZVL96AMLFR

NXP

S12Z CPU, 96K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 10x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

package: -

Request a Quote

16-Bit

32MHz

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

LVD, POR, PWM, WDT

34

96KB (96K x 8)

FLASH

512 x 8

8K x 8

5.5V ~ 18V

A/D 10x10b

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP

48-LQFP (7x7)

S32K324NHT1MPBIR

NXP

IC MCU 32BIT 4MB FLASH 172QFP

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 160MHz
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: 143
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 172-QFP
Supplier Device Package: 172-QFP (16x16)

package: -

Request a Quote

32-Bit Dual-Core

160MHz

CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART

DMA, I2S, WDT

143

4MB (4M x 8)

FLASH

128K x 8

512K x 8

2.97V ~ 5.5V

A/D 24x12b SAR

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

172-QFP

172-QFP (16x16)