Microchip Technology Producten

DSC6003HI1A-PROGRAMMABLE

Microchip Technology

PROG OSC 1MHZ-80MHZ CMOS

• Type: MEMS (Silicon)
• Programmable Type: Programmed as Request
• Available Frequency Range: 1MHz ~ 80MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 1.71 V ~ 3.63 V
• Frequency Stability: -
• Frequency Stability (Total): ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Spread Spectrum Bandwidth: -
• Current - Supply (Max): 1.3mA (Typ)
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
• Height: 0.035" (0.89mm)

package: 4-SMD, No Lead

DSC1001DI4-060.0700T

Microchip Technology

OSC MEMS 60.07MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 60.07MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: -
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

MCP1258-E/MF

Microchip Technology

IC REG SWITCHD CAP 3.3V 10DFN

• Function: Step-Up
• Output Configuration: Positive
• Topology: Charge Pump
• Output Type: Fixed
• Number of Outputs: 1
• Voltage - Input (Min): 1.8V
• Voltage - Input (Max): 3.6V
• Voltage - Output (Min/Fixed): 3.3V
• Voltage - Output (Max): -
• Current - Output: 100mA
• Frequency - Switching: 650kHz
• Synchronous Rectifier: No
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-DFN (3x3)

package: 10-VFDFN Exposed Pad

MCP1317T-31LE/OT

Microchip Technology

IC SUPERVISOR 3.1V SOT23-5

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active High
• Reset Timeout: 140 ms Minimum
• Voltage - Threshold: 3.1V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

package: SC-74A, SOT-753

AT87C51RD2-RLTUM

Microchip Technology

IC MCU 8BIT 64KB OTP 44VQFP

• Core Processor: 80C51
• Core Size: 8-Bit
• Speed: 40/20MHz
• Connectivity: UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-LQFP

PIC17LC752T-08I/L

Microchip Technology

IC MCU 8BIT 16KB OTP 68PLCC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 678 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (24.23x24.23)

package: 68-LCC (J-Lead)

PIC32MZ2064DAH169T-I/6J

Microchip Technology

IC MCU 32BIT 2MB FLASH 169LFBGA

• Core Processor: MIPS32? microAptiv?
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, PMP, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
• Number of I/O: 120
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 640K x 8
• Voltage - Supply (Vcc/Vdd): 1.7 V ~ 3.6 V
• Data Converters: A/D 45x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 169-LFBGA
• Supplier Device Package: 169-LFBGA (11x11)

package: 169-LFBGA

PIC16F1527-I/MR

Microchip Technology

IC MCU 8BIT 28KB FLASH 64QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 28KB (16K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 30x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

package: 64-VFQFN Exposed Pad

MCP45HV51T-104E/ST

Microchip Technology

IC DGTL POT 100K 256TAPS 14TSSOP

• Taper: Linear
• Configuration: Potentiometer
• Number of Circuits: 1
• Number of Taps: 256
• Resistance (Ohms): 100k
• Interface: I2C
• Memory Type: Volatile
• Voltage - Supply: 1.8 V ~ 5.5 V, 10 V ~ 36 V, ±5V ~ 18 V
• Features: Mute, Selectable Address
• Tolerance: ±20%
• Temperature Coefficient (Typ): 100 ppm/°C
• Resistance - Wiper (Ohms) (Typ): 145
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

package: 14-TSSOP (0.173", 4.40mm Width)

MCP3008-I/P

Microchip Technology

IC ADC 10BIT 2.7V 8CH SPI 16DIP

• Number of Bits: 10
• Sampling Rate (Per Second): 200k
• Number of Inputs: 4, 8
• Input Type: Pseudo-Differential, Single Ended
• Data Interface: SPI
• Configuration: MUX-S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: SAR
• Reference Type: External
• Voltage - Supply, Analog: 2.7 V ~ 5.5 V
• Voltage - Supply, Digital: 2.7 V ~ 5.5 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-PDIP
• Mounting Type: -

package: 16-DIP (0.300", 7.62mm)

MCP3201T-CI/SN

Microchip Technology

IC ADC 12BIT 2.7V 1CH SPI 8-SOIC

• Number of Bits: 12
• Sampling Rate (Per Second): 100k
• Number of Inputs: 1
• Input Type: Pseudo-Differential
• Data Interface: SPI
• Configuration: S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: SAR
• Reference Type: External
• Voltage - Supply, Analog: 2.7 V ~ 5.5 V
• Voltage - Supply, Digital: 2.7 V ~ 5.5 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC
• Mounting Type: -

package: 8-SOIC (0.154", 3.90mm Width)

SY58031UMG-TR

Microchip Technology

IC CLK BUFFER 1:8 6GHZ 32MLF

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:8
• Differential - Input:Output: Yes/Yes
• Input: CML, LVDS, LVPECL
• Output: CML
• Frequency - Max: 6GHz
• Voltage - Supply: 2.375 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad, 32-MLF?
• Supplier Device Package: 32-MLF? (5x5)

package: 32-VFQFN Exposed Pad, 32-MLF?

93LC66C/WF15K

Microchip Technology

IC EEPROM 4K SPI 3MHZ WAFER

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Kb (512 x 8, 256 x 16)
• Memory Interface: SPI
• Clock Frequency: 3MHz
• Write Cycle Time - Word, Page: 6ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

package: Die

GC2511-150A

Microchip Technology

SI SRD NON HERMETIC EPSM SMT

• Capacitance @ Vr, F: 0.6pF @ 6V, 1MHz
• Capacitance Ratio: -
• Capacitance Ratio Condition: -
• Voltage - Peak Reverse (Max): 15 V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

package: -

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UM9700SM

Microchip Technology

SI PPIN HERMETIC MELF

• Diode Type: -
• Voltage - Peak Reverse (Max): -
• Current - Max: -
• Capacitance @ Vr, F: -
• Resistance @ If, F: -
• Power Dissipation (Max): -
• Operating Temperature: -
• Package / Case: SQ-MELF
• Supplier Device Package: -

package: -

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S3410

Microchip Technology

DIODE GEN PURP 100V DO5

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 100 V
• Current - Average Rectified (Io): 45A
• Voltage - Forward (Vf) (Max) @ If: 1.15 V @ 90 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 10 µA @ 100 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5 (DO-203AB)
• Operating Temperature - Junction: -65°C ~ 200°C

package: -

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CDLL5236-TR

Microchip Technology

DIODE ZENER 7.5V DO-213AB

• Voltage - Zener (Nom) (Vz): 7.5 V
• Tolerance: ±20%
• Power - Max: -
• Impedance (Max) (Zzt): 6 Ohms
• Current - Reverse Leakage @ Vr: 3 µA @ 6 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF
• Supplier Device Package: DO-213AB

package: -

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UMX1089SM-TR

Microchip Technology

SI PPIN HERMETIC MELF

• Diode Type: -
• Voltage - Peak Reverse (Max): -
• Current - Max: -
• Capacitance @ Vr, F: -
• Resistance @ If, F: -
• Power Dissipation (Max): -
• Operating Temperature: -
• Package / Case: SQ-MELF
• Supplier Device Package: -

package: -

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JANTX1N747AUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 3.6 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 24 Ohms
• Current - Reverse Leakage @ Vr: 3 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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2N3637UB-TR

Microchip Technology

TRANS PNP 175V 1A UB

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 1 A
• Voltage - Collector Emitter Breakdown (Max): 175 V
• Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
• Current - Collector Cutoff (Max): 10µA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 10V
• Power - Max: 1.5 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 3-SMD, No Lead
• Supplier Device Package: UB

package: -

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1N5279BUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 180 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 2200 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 137 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

1N1370A

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 62 V
• Tolerance: ±5%
• Power - Max: 10 W
• Impedance (Max) (Zzt): 12 Ohms
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AA, DO-4, Stud
• Supplier Device Package: DO-203AA (DO-4)

package: -

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S43120IL

Microchip Technology

DIODE GP 1.2KV 150A DO205AA

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 1200 V
• Current - Average Rectified (Io): 150A
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 50 µA @ 1200 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-205AA, DO-8, Stud
• Supplier Device Package: DO-205AA (DO-8)
• Operating Temperature - Junction: -65°C ~ 200°C

package: -

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1N3044B-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 100 V
• Tolerance: ±5%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 350 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 76 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -55°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO-41, Axial
• Supplier Device Package: DO-204AL (DO-41)

package: -

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CDLL6759-TR

Microchip Technology

DIODE SCHOTTKY 60V 1A DO213AB

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 60 V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 690 mV @ 1 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 100 µA @ 60 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF
• Supplier Device Package: DO-213AB
• Operating Temperature - Junction: -55°C ~ 125°C

package: -

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JANS1N6488US

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 4.3 V
• Tolerance: ±5%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 9 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: A, SQ-MELF

package: -

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CDLL4926A

Microchip Technology

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 19.2 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 75 Ohms
• Current - Reverse Leakage @ Vr: 15 µA @ 12 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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JANS1N6343

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 62 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 125 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 47 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: B, Axial
• Supplier Device Package: B, Axial

package: -

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