Microchip Technology Producten

DSC1001CE2-048.0000

Microchip Technology

OSC MEMS 48.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 48MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

DSC1123AE2-100.0000

Microchip Technology

OSC MEMS 100.000MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 100MHz
• Function: Enable/Disable
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 32mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead, Exposed Pad

MIC2124YMM-TR

Microchip Technology

IC REG CTRLR BUCK 10MSOP

• Output Type: Transistor Driver
• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Number of Outputs: 1
• Output Phases: 1
• Voltage - Supply (Vcc/Vdd): 3 V ~ 18 V
• Frequency - Switching: 300kHz
• Duty Cycle (Max): 91%
• Synchronous Rectifier: Yes
• Clock Sync: No
• Serial Interfaces: -
• Control Features: Enable
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-MSOP

package: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

MCP73864-I/ML

Microchip Technology

IC CONTROLLER LI-ION 4.5V 16QFN

• Battery Chemistry: Lithium-Ion/Polymer
• Number of Cells: 2
• Current - Charging: Constant - Programmable
• Programmable Features: Timer
• Fault Protection: -
• Charge Current - Max: 1.38A
• Battery Pack Voltage: 8.4V
• Voltage - Supply (Max): 12V
• Interface: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-VQFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (4x4)

package: 16-VQFN Exposed Pad

AT25080B-CUL-T

Microchip Technology

IC EEPROM 8KBIT 20MHZ 8VFBGA

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 8Kb (1K x 8)
• Memory Interface: SPI
• Clock Frequency: 20MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

93LC46A-I/SN

Microchip Technology

IC EEPROM 1KBIT 2MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (128 x 8)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 6ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

SY100E404JC

Microchip Technology

IC GATE AND/NAND QUAD 28-PLCC

• Logic Type: AND/NAND Gate
• Number of Circuits: 4
• Number of Inputs: 8 Input (2, 2, 2, 2)
• Schmitt Trigger Input: No
• Output Type: Differential
• Current - Output High, Low: -
• Voltage - Supply: 4.2 V ~ 5.5 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.5x11.5)

package: 28-LCC (J-Lead)

MCP6494T-E/ST

Microchip Technology

IC OPAMP GP 7.5MHZ RRO 14TSSOP

• Amplifier Type: General Purpose
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 6 V/µs
• Gain Bandwidth Product: 7.5MHz
• -3db Bandwidth: -
• Current - Input Bias: 1pA
• Voltage - Input Offset: 1.5mV
• Current - Supply: 530µA
• Current - Output / Channel: 15mA
• Voltage - Supply, Single/Dual (±): 2.4 V ~ 5.5 V, ±1.2 V ~ 2.75 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

package: 14-TSSOP (0.173", 4.40mm Width)

USB2514-AEZG-TR

Microchip Technology

IC CONTROLLER USB 36QFN

• Protocol: USB
• Function: Hub Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: -
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 36-VFQFN Exposed Pad
• Supplier Device Package: 36-QFN (6x6)

package: 36-VFQFN Exposed Pad

PIC16C642-20E/SP

Microchip Technology

IC MCU 8BIT 7KB OTP 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, LED, POR, WDT
• Number of I/O: 22
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 176 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

AT32UC3A4256-C1UT

Microchip Technology

IC MCU 32BIT 256KB FLASH 100BGA

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number of I/O: 88
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.75 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-VFBGA
• Supplier Device Package: 100-VFBGA (7x7)

package: 100-VFBGA

PIC32MX350F256LT-V/PF

Microchip Technology

IC MCU 32BIT 256KB FLASH 100TQFP

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

package: 100-TQFP

PIC24FJ32MC102T-I/ML

Microchip Technology

IC MCU 16BIT 32KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 16 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 32KB (11K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

package: 28-VQFN Exposed Pad

ATSAM4LS2AA-MU

Microchip Technology

IC MCU 32BIT 128KB FLASH 48QFN

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.68 V ~ 3.6 V
• Data Converters: A/D 3x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

package: 48-VFQFN Exposed Pad

PIC16F689-I/P

Microchip Technology

IC MCU 8BIT 7KB FLASH 20DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 18
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-PDIP

package: 20-DIP (0.300", 7.62mm)

SY10E111AEJI

Microchip Technology

IC CLK BUFFER 1:9 28PLCC

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:9
• Differential - Input:Output: Yes/Yes
• Input: PECL
• Output: PECL
• Frequency - Max: -
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.51x11.51)

package: 28-LCC (J-Lead)

PL130-07SI

Microchip Technology

IC CLK BUFFER 1:1 200MHZ 8SOIC

• Type: Buffer/Driver
• Number of Circuits: 1
• Ratio - Input:Output: 1:1
• Differential - Input:Output: No/No
• Input: LVCMOS, Sine Wave
• Output: LVCMOS
• Frequency - Max: 200MHz
• Voltage - Supply: 2.5 V ~ 3.3 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOP

package: 8-SOIC (0.154", 3.90mm Width)

AT86RF401X-6GS

Microchip Technology

IC MICRO TRANSM RF W/AVR 20TSSOP

• Frequency: 264MHz ~ 456MHz
• Applications: Garage Opener, RKE, Telemetry
• Modulation or Protocol: ASK, OOK
• Data Rate (Max): 10 kbps
• Power - Output: 6dBm
• Current - Transmitting: 23.2mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: 1KB EEPROM, 1KB RAM
• Features: -
• Voltage - Supply: 2 V ~ 5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)

package: 20-TSSOP (0.173", 4.40mm Width)

PIC32MM0032GPL036-E/MV

Microchip Technology

32KB FLASH, 8KB RAM, 79 COREMARK

• Core Processor: MIPS32® microAptiv™
• Core Size: 32-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
• Number of I/O: 29
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 14x10/12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 40-UFQFN Exposed Pad
• Supplier Device Package: 40-UQFN (5x5)

package: 40-UFQFN Exposed Pad

PIC32MM0064GPL020-E/SS

Microchip Technology

64KB FLASH, 8KB RAM, 79 COREMARK

• Core Processor: MIPS32® microAptiv™
• Core Size: 32-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, I²S, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 11x10/12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: 20-SSOP (0.209", 5.30mm Width)

UM4001SM-TR

Microchip Technology

SI PPIN HERMETIC MELF

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 100V
• Current - Max: -
• Capacitance @ Vr, F: 3pF @ 100V, 1MHz
• Resistance @ If, F: 500mOhm @ 100mA, 100MHz
• Power Dissipation (Max): 100000 W
• Operating Temperature: -65°C ~ 175°C
• Package / Case: SQ-MELF
• Supplier Device Package: -

package: -

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MIC33M356-SAYMP-TR

Microchip Technology

IC REG BUCK ADJ 3A 24QFN

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Adjustable
• Number of Outputs: 1
• Voltage - Input (Min): 2.4V
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 0.6V
• Voltage - Output (Max): 3.84V
• Current - Output: 3A
• Frequency - Switching: 2.2MHz
• Synchronous Rectifier: Yes
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 24-PowerFQFN
• Supplier Device Package: 24-QFN (3x4.5)

package: -

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S3680

Microchip Technology

DIODE GEN PURP 800V 70A DO203AB

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 800 V
• Current - Average Rectified (Io): 70A
• Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 25 µA @ 800 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-203AB (DO-5)
• Operating Temperature - Junction: -65°C ~ 200°C

package: -

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JANTX1N6336US-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 33 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 40 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 25 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

package: -

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2C5333-MSCL

Microchip Technology

POWER BJT

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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JANSR2N2920

Microchip Technology

RH SMALL-SIGNAL BJT

• Transistor Type: 2 NPN (Dual)
• Current - Collector (Ic) (Max): 30mA
• Voltage - Collector Emitter Breakdown (Max): 60V
• Vce Saturation (Max) @ Ib, Ic: 300mV @ 100µA, 1mA
• Current - Collector Cutoff (Max): 10µA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
• Power - Max: 350mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-78-6 Metal Can
• Supplier Device Package: TO-78-6

package: -

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2N2221AUA-TR

Microchip Technology

SMALL-SIGNAL BJT

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 800 mA
• Voltage - Collector Emitter Breakdown (Max): 50 V
• Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
• Current - Collector Cutoff (Max): 50nA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 150mA, 10V
• Power - Max: 650 mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Supplier Device Package: UA

package: -

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AVR64DB32T-I-RXB

Microchip Technology

IC MCU 8BIT 64KB FLASH 32VQFN

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 13x12b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-VQFN (5x5)

package: -

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