Microchip Technology Producten

DSC1001CI5-024.5760T

Microchip Technology

OSC MEMS 24.576MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 24.576MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

TP2640N3-G

Microchip Technology

MOSFET P-CH 400V 0.18A TO92-3

• FET Type: P-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 400V
• Current - Continuous Drain (Id) @ 25°C: 180mA (Tj)
• Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 1W (Ta)
• Rds On (Max) @ Id, Vgs: 15 Ohm @ 300mA, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-92-3
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)

package: TO-226-3, TO-92-3 (TO-226AA)

TC7107CKW713

Microchip Technology

IC ADC 3 1/2DGT LED DVR 44-MQFP

• Display Type: LED
• Configuration: 7 Segment
• Interface: -
• Digits or Characters: A/D 3.5 Digits
• Current - Supply: 800µA
• Voltage - Supply: 5V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 44-QFP
• Supplier Device Package: 44-MQFP (10x10)

package: 44-QFP

SY100S307FC

Microchip Technology

IC GATE OR/NOR QUINT 24-CERPACK

• Logic Type: XOR/NOR Gate
• Number of Circuits: 5
• Number of Inputs: 10 Input (2, 2, 2, 2, 2)
• Schmitt Trigger Input: No
• Output Type: Differential
• Current - Output High, Low: -
• Voltage - Supply: 4.2 V ~ 5.5 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-CQFlatpack, Cerpack
• Supplier Device Package: 24-CerPack

package: 24-CQFlatpack, Cerpack

TS68EN360VA25L

Microchip Technology

IC MPU CPU32 25MHZ 240CERQUAD

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: -40°C ~ 85°C (TC)
• Security Features: -
• Package / Case: 240-BFCQFP
• Supplier Device Package: 240-CerQuad

package: 240-BFCQFP

PIC16C67T-10/PQ

Microchip Technology

IC MCU 8BIT 14KB OTP 44MQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 33
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 368 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: 44-MQFP (10x10)

package: 44-QFP

DSPIC30F6012-20I/PF

Microchip Technology

IC MCU 16BIT 144KB FLASH 64TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I2C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I2S, LVD, POR, PWM, WDT
• Number of I/O: 52
• Program Memory Size: 144KB (48K x 24)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (14x14)

package: 64-TQFP

PIC32MZ1024ECM124T-I/TL

Microchip Technology

IC MCU 32BIT 1MB FLASH 124VTLA

• Core Processor: MIPS32? microAptiv?
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 98
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 124-VFTLA Dual Row Exposed Pad
• Supplier Device Package: 124-VTLA (9x9)

package: 124-VFTLA Dual Row Exposed Pad

PIC17C42A-16I/P

Microchip Technology

IC MCU 8BIT 4KB OTP 40DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 33
• Program Memory Size: 4KB (2K x 16)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 232 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIP

package: 40-DIP (0.600", 15.24mm)

PIC32MX764F128LT-V/BG

Microchip Technology

IC MCU 32BIT 128KB FLASH 121BGA

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-TFBGA (10x10)

package: 121-TFBGA

PIC16LC622-04/SS

Microchip Technology

IC MCU 8BIT 3.5KB OTP 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 13
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: 20-SSOP (0.209", 5.30mm Width)

PIC16F76-E/SP

Microchip Technology

IC MCU 8BIT 14KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 368 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

PIC16F1619-I/ML

Microchip Technology

IC MCU 8BIT 14KB FLASH 20QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 12x10b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (4x4)

package: 20-VFQFN Exposed Pad

1N2497

Microchip Technology

DIODE GEN PURP 600V 6A DO4

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 600 V
• Current - Average Rectified (Io): 6A
• Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 10 µA @ 600 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AA, DO-4, Stud
• Supplier Device Package: DO-4 (DO-203AA)
• Operating Temperature - Junction: -65°C ~ 200°C

package: -

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JANKCBD2N3439

Microchip Technology

RH POWER BJT

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 1 A
• Voltage - Collector Emitter Breakdown (Max): 350 V
• Vce Saturation (Max) @ Ib, Ic: 500mV @ 4mA, 50mA
• Current - Collector Cutoff (Max): 2µA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 20mA, 10V
• Power - Max: 800 mW
• Frequency - Transition: -
• Operating Temperature: -55°C ~ 200°C
• Mounting Type: Through Hole
• Package / Case: TO-205AD, TO-39-3 Metal Can
• Supplier Device Package: TO-39 (TO-205AD)

package: -

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1N6762

Microchip Technology

DIODE ARRAY GP 50V 12A TO254AA

• Diode Configuration: 1 Pair Common Cathode
• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 50 V
• Current - Average Rectified (Io) (per Diode): 12A
• Voltage - Forward (Vf) (Max) @ If: 1.05 V @ 12 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 35 ns
• Current - Reverse Leakage @ Vr: 10 µA @ 50 V
• Operating Temperature - Junction: -
• Mounting Type: Through Hole
• Package / Case: TO-254-3, TO-254AA
• Supplier Device Package: TO-254AA

package: -

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1N5264-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 60 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 170 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 44 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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2N5663U3

Microchip Technology

POWER BJT

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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JANTX1N6940UTK3CS-TR

Microchip Technology

DIODE SCHOTTKY 15V 150A THINKEY3

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 15 V
• Current - Average Rectified (Io): 150A
• Voltage - Forward (Vf) (Max) @ If: 500 mV @ 150 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 5 mA @ 15 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: ThinKey™3
• Supplier Device Package: ThinKey™3
• Operating Temperature - Junction: -65°C ~ 175°C

package: -

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JAN1N5712UB

Microchip Technology

DIODE SCHOTTKY UB

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Supplier Device Package: UB
• Operating Temperature - Junction: 150°C (Max)

package: -

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UES1303SM

Microchip Technology

DIODE GEN PURP 150V 8A D-5B

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 150 V
• Current - Average Rectified (Io): 8A
• Voltage - Forward (Vf) (Max) @ If: 925 mV @ 6 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 30 ns
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: D-5B
• Operating Temperature - Junction: -

package: -

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JANTX2N918UB-TR

Microchip Technology

TRANS NPN 15V 0.05A UB

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 50 mA
• Voltage - Collector Emitter Breakdown (Max): 15 V
• Vce Saturation (Max) @ Ib, Ic: 400mV @ 1mA, 10mA
• Current - Collector Cutoff (Max): 1µA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 3mA, 1V
• Power - Max: 200 mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Supplier Device Package: UB

package: -

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KV2801-00

Microchip Technology

SI TVAR NON HERMETIC CHIP

• Capacitance @ Vr, F: 5.1pF @ 20V, 1MHz
• Capacitance Ratio: 5.9
• Capacitance Ratio Condition: C3/C20
• Voltage - Peak Reverse (Max): 22 V
• Diode Type: Single
• Q @ Vr, F: 250 @ 3V, 50MHz
• Operating Temperature: -55°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

package: -

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UES1106E3

Microchip Technology

RECTIFIER

• Diode Type: -
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: -
• Speed: -
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -
• Operating Temperature - Junction: -

package: -

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R36150

Microchip Technology

STD RECTIFIER

• Diode Type: -
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: -
• Speed: -
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -
• Operating Temperature - Junction: -

package: -

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JANTX2N5671

Microchip Technology

TRANS NPN 90V 30A TO3

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 30 A
• Voltage - Collector Emitter Breakdown (Max): 90 V
• Vce Saturation (Max) @ Ib, Ic: 5V @ 6A, 30A
• Current - Collector Cutoff (Max): 10mA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 20A, 5V
• Power - Max: 6 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-204AA, TO-3
• Supplier Device Package: TO-3

package: -

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2C4240

Microchip Technology

POWER BJT

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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PIC18F45Q71T-I-PT

Microchip Technology

32KB FLASH, 2KB RAM, 2X OPA, 12-

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 37
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 35x12b SAR; D/A 2, 1x8/10b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

package: -