Microchip Technology Producten

DSC6111HE1A-PROGRAMMABLE

Microchip Technology

PROG OSC 1MHZ-100MHZ CMOS

• Type: MEMS (Silicon)
• Programmable Type: Programmed as Request
• Available Frequency Range: 1MHz ~ 100MHz
• Function: Standby
• Output: CMOS
• Voltage - Supply: 1.71 V ~ 3.63 V
• Frequency Stability: -
• Frequency Stability (Total): ±50ppm
• Operating Temperature: -20°C ~ 70°C
• Spread Spectrum Bandwidth: -
• Current - Supply (Max): 3mA (Typ)
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
• Height: 0.035" (0.89mm)

package: 4-SMD, No Lead

DSC1121BI5-150.0000

Microchip Technology

OSC MEMS 150.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 150MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 35mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead

DSC1121DI2-148.5000T

Microchip Technology

OSC MEMS 148.5MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 148.5MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 35mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead

DSC1001AI2-060.0000T

Microchip Technology

OSC MEMS 60.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 60MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead Exposed Pad

DSC1121AI5-050.0000

Microchip Technology

OSC MEMS 50.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 50MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 35mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead, Exposed Pad

MIC810JYC3-TR

Microchip Technology

IC RESET GEN 4.63V VTH SC70

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active High
• Reset Timeout: 140 ms Minimum
• Voltage - Threshold: 4V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SC-70-3

package: SC-70, SOT-323

AT28C256-15FM/883-815

Microchip Technology

IC EEPROM 256KBIT 150NS 28FLATPK

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 256Kb (32K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 150ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C (TC)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

24LC16BT-E/MNY

Microchip Technology

IC EEPROM 16KBIT 400KHZ 8TDFN

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 16Kb (2K x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 900ns
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-WFDFN Exposed Pad
• Supplier Device Package: 8-TDFN (2x3)

package: 8-WFDFN Exposed Pad

93AA66B-I/MS

Microchip Technology

IC EEPROM 4KBIT 2MHZ 8MSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Kb (256 x 16)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 6ms
• Access Time: -
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

PIC16LC554-04E/P

Microchip Technology

IC MCU 8BIT 896B OTP 18DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 13
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 80 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 18-DIP (0.300", 7.62mm)
• Supplier Device Package: 18-PDIP

package: 18-DIP (0.300", 7.62mm)

DSPIC33EP512GM306-H/PT

Microchip Technology

IC MCU 16BIT 512KB FLASH 64TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: -
• Connectivity: I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 512KB (170K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: A/D 30x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

package: 64-TQFP

PIC16LF1778-E/SO

Microchip Technology

IC MCU 8BIT 28KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 28KB (16K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 17x10b, D/A 3x5b, 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

PIC16LF1778-I/SP

Microchip Technology

IC MCU 8BIT 28KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 28KB (16K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 17x10b, D/A 3x5b, 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

PIC16LF1719-E/MV

Microchip Technology

IC MCU 8BIT 28KB FLASH 40UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 28KB (16K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 28x10b, D/A 1x5b, 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 40-UFQFN Exposed Pad
• Supplier Device Package: 40-UQFN (5x5)

package: 40-UFQFN Exposed Pad

PIC16F722-E/SP

Microchip Technology

IC MCU 8BIT 3.5KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 11x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

PIC16F722-E/SS

Microchip Technology

IC MCU 8BIT 3.5KB FLASH 28SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 11x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

package: 28-SSOP (0.209", 5.30mm Width)

SCH3224I-SY

Microchip Technology

LPC IO WITH 8042 KBC RESET GENER

• Applications: I/O Controller
• Core Processor: 8042 Keyboard Controller
• Program Memory Type: ROM (2 kB)
• Controller Series: -
• RAM Size: 256 x 8
• Interface: IrDA, LPC, Parallel, Serial, UART
• Number of I/O: 24
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-WFBGA
• Supplier Device Package: 100-WFBGA (8x8)

package: 100-WFBGA

T48C862M-R3-TNS

Microchip Technology

IC MON TIRE PRESS 315MHZ 24SOIC

• Frequency: 315MHz
• Applications: -
• Modulation or Protocol: FM, FSK
• Data Rate (Max): 32 kBaud
• Power - Output: 10dBm
• Current - Transmitting: 9.5mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: 1KB EEPROM, 1KB RAM
• Features: -
• Voltage - Supply: 2 V ~ 4 V
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 24-SOIC (0.209", 5.30mm Width)

package: 24-SOIC (0.209", 5.30mm Width)

ATA8205P6C-TKQY

Microchip Technology

ISM RF RECEIVER 868 MHZ

• Frequency: 868MHz
• Sensitivity: -111dBm
• Data Rate (Max): 10 kbps
• Modulation or Protocol: ASK, FSK
• Applications: General Purpose
• Current - Receiving: 8.5mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: RSSI Equipped
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSO

package: 20-LSSOP (0.173", 4.40mm Width)

PIC18F25K83T-I/MX

Microchip Technology

FLASH

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 24x12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-UQFN Exposed Pad
• Supplier Device Package: 28-UQFN (6x6)

package: 28-UQFN Exposed Pad

1N4098

Microchip Technology

DIODE ZENER 150V A AXIAL

• Voltage - Zener (Nom) (Vz): 150 V
• Tolerance: ±5%
• Power - Max: -
• Impedance (Max) (Zzt): 650 Ohms
• Current - Reverse Leakage @ Vr: 1 µA @ 114 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: A, Axial
• Supplier Device Package: A, Axial

package: -

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1N5245

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 15 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 16 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 10.5 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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2N930UB

Microchip Technology

NPN TRANSISTOR

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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JANTX1N6347DUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 91 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 270 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 69 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

package: -

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JANHCA1N5525D

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 6.2 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 30 Ohms
• Current - Reverse Leakage @ Vr: 1 µA @ 5 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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MCP48FEB14-E-ML

Microchip Technology

QUAD CHANNEL EEPROM I2C DAC

• Number of Bits: -
• Number of D/A Converters: -
• Settling Time: -
• Output Type: -
• Differential Output: -
• Data Interface: -
• Reference Type: -
• Voltage - Supply, Analog: -
• Voltage - Supply, Digital: -
• INL/DNL (LSB): -
• Architecture: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

package: -

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JANTX1N4126DUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 51 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 300 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 38.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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SPD1150

Microchip Technology

POWER SCHOTTKY

• Diode Type: -
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: -
• Speed: -
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -
• Operating Temperature - Junction: -

package: -

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