Microchip Technology Producten

TC1313-1P0EMFTR

Microchip Technology

IC REG DL BUCK/LINEAR SYNC 10DFN

• Topology: Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
• Function: Any Function
• Number of Outputs: 2
• Frequency - Switching: 2MHz
• Voltage/Current - Output 1: 1.375V, 500mA
• Voltage/Current - Output 2: 1.8V, 300mA
• Voltage/Current - Output 3: -
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: No
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-DFN (3x3)

package: 10-VFDFN Exposed Pad

AT49BV001T-12VC

Microchip Technology

IC FLASH 1MBIT 120NS 32VSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 1Mb (128K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 50µs
• Access Time: 120ns
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-TFSOP (0.488", 12.40mm Width)
• Supplier Device Package: 32-VSOP

package: 32-TFSOP (0.488", 12.40mm Width)

24AA025E48T-I/SN

Microchip Technology

IC EEPROM 2KBIT 400KHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 2Kb (256 x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 900ns
• Voltage - Supply: 1.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

SY100EPT23LKC

Microchip Technology

IC TRANSLATOR DUAL 3.3V 8-MSOP

• Translator Type: Mixed Signal
• Channel Type: Unidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: LVPECL
• Output Signal: LVTTL
• Output Type: Non-Inverted
• Data Rate: -
• Operating Temperature: 0°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

SY100EL91LZC

Microchip Technology

IC TRANSLATOR TRIPLE 20-SOIC

• Translator Type: Mixed Signal
• Channel Type: Unidirectional
• Number of Circuits: 1
• Channels per Circuit: 3
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: LVPECL
• Output Signal: ECL, LVECL
• Output Type: Differential
• Data Rate: -
• Operating Temperature: 0°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

MCP25625-E/ML

Microchip Technology

IC TXRX CAN CTLR EXT TEMP 28QFN

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: 200mV
• Data Rate: -
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

package: 28-VQFN Exposed Pad

USB5537B-6080AKZE

Microchip Technology

IC HUB CTLR USB 72VQFN

• Protocol: USB
• Function: Hub Controller
• Interface: USB
• Standards: USB 3.0
• Voltage - Supply: 1.25V, 3.3V
• Current - Supply: -
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 72-VFQFN Exposed Pad
• Supplier Device Package: 72-QFN (10x10)

package: 72-VFQFN Exposed Pad

PIC16LF1705T-I/ST

Microchip Technology

IC MCU 8BIT 14KB FLASH 14TSSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

package: 14-TSSOP (0.173", 4.40mm Width)

PIC18F46K42-I/PT

Microchip Technology

64KB FLASH, 4KB RAM, 1KB EEPROM

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

PIC16F1618T-I/GZ

Microchip Technology

IC MCU 8BIT 7KB FLASH 20UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 12x10b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-UFQFN Exposed Pad
• Supplier Device Package: 20-UQFN (4x4)

package: 20-UFQFN Exposed Pad

ATXMEGA128A1-CU

Microchip Technology

IC MCU 8BIT 128KB FLASH 100CBGA

• Core Processor: AVR
• Core Size: 8/16-Bit
• Speed: 32MHz
• Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 78
• Program Memory Size: 128KB (64K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.6 V ~ 3.6 V
• Data Converters: A/D 16x12b, D/A 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-CBGA (9x9)

package: 100-TFBGA

PIC24HJ64GP206-I/PT

Microchip Technology

IC MCU 16BIT 64KB FLASH 64TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 64KB (22K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

package: 64-TQFP

MT8888CSR1

Microchip Technology

IC TXRX DTMF 20SOIC

• Function: DTMF Transceiver
• Interface: -
• Number of Circuits: 1
• Voltage - Supply: 4.75V ~ 5.25V
• Current - Supply: 7mA
• Power (Watts): -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

40CDQ040

Microchip Technology

DIODE SCHOTTKY 40V 30A TO204AA

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 40 V
• Current - Average Rectified (Io): 30A
• Voltage - Forward (Vf) (Max) @ If: 700 mV @ 30 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 1.5 mA @ 40 V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: TO-204AA, TO-3
• Supplier Device Package: TO-204AA (TO-3)
• Operating Temperature - Junction: -65°C ~ 175°C

package: -

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JANTXV1N3911A

Microchip Technology

DIODE GEN PURP 200V 50A DO5

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 200 V
• Current - Average Rectified (Io): 50A
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 50 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 150 ns
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5 (DO-203AB)
• Operating Temperature - Junction: -65°C ~ 150°C

package: -

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JANTXV1N4961DUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 13 V
• Tolerance: ±1%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 3 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: E-MELF

package: -

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CDLL5535C

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 15 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 13.5 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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JANS1N6349CUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 110 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 500 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 84 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

package: -

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CD4699

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 12 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 50 nA @ 9.1 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

package: -

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DSC400-0333Q0154KI1T

Microchip Technology

IC CLOCK GENERATOR 20QFN

• Type: Clock Generator
• PLL: Yes
• Input: Clock
• Output: HCSL, LVCMOS, LVDS, LVPECL
• Number of Circuits: 2
• Ratio - Input:Output: 2:4
• Differential - Input:Output: No/Yes
• Frequency - Max: 176.875MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 2.25V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (5x3.2)

package: -

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1N4921A-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): 19.2 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 300 Ohms
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -55°C ~ 100°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-35

package: -

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JANTX2N3500U4

Microchip Technology

TRANS NPN 150V 0.3A U4

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 300 mA
• Voltage - Collector Emitter Breakdown (Max): 150 V
• Vce Saturation (Max) @ Ib, Ic: 400mV @ 15mA, 150mA
• Current - Collector Cutoff (Max): 50nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 150mA, 10V
• Power - Max: 1 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 3-SMD, No Lead
• Supplier Device Package: U4

package: -

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1N3491R

Microchip Technology

DIODE GEN PURP REV 50V 35A DO21

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 50 V
• Current - Average Rectified (Io): 35A
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 10 µA @ 50 V
• Capacitance @ Vr, F: -
• Mounting Type: Press Fit
• Package / Case: DO-208AA
• Supplier Device Package: DO-21
• Operating Temperature - Junction: -65°C ~ 175°C

package: -

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MS8250-P2920

Microchip Technology

GAAS SCHOTTKY NON HERMETIC FLIP

• Diode Type: Schottky - Anti-Parallel
• Voltage - Peak Reverse (Max): 3V
• Current - Max: 15 mA
• Capacitance @ Vr, F: 80fF @ 0V, 1MHz
• Resistance @ If, F: 7Ohm @ 10mA, 100MHz
• Power Dissipation (Max): -
• Operating Temperature: -55°C ~ 125°C
• Package / Case: Die
• Supplier Device Package: Chip

package: -

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JANS1N4581AUR-1-TR

Microchip Technology

TEMPERATURE COMPENSATED

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 25 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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PIC18F57Q43-I-PT

Microchip Technology

IC MCU 8BIT 128KB FLASH 48TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 44
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 43x12b; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP Exposed Pad
• Supplier Device Package: 48-TQFP-EP (7x7)

package: -

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JANTXV1N6310CUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 2.7 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 30 Ohms
• Current - Reverse Leakage @ Vr: 60 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

package: -

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AVR16EB20-I-SS

Microchip Technology

16KB RWW,2KB RAM,20MHZ,12-BIT AD

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 14x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: -

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