Microchip Technology Producten

DSC1001DI1-005.0000T

Microchip Technology

OSC MEMS 5.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 5MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

MIC2210-FMYML-TR

Microchip Technology

IC REG LINEAR 1.5V/2.8V 10MLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.5V, 2.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.25V @ 150mA, 0.42V @ 300mA
• Current - Output: 150mA, 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 80µA
• PSRR: 60dB ~ 40dB (1KHz ~ 20kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad, 10-MLF?
• Supplier Device Package: 10-MLF? (3x3)

package: 10-VFDFN Exposed Pad, 10-MLF?

MIC4423CWM TR

Microchip Technology

IC DRIVER MOSFET 3A DUAL 16-SOIC

• Driven Configuration: Low-Side
• Channel Type: Independent
• Number of Drivers: 2
• Gate Type: N-Channel, P-Channel MOSFET
• Voltage - Supply: 4.5 V ~ 18 V
• Logic Voltage - VIL, VIH: 0.8V, 2.4V
• Current - Peak Output (Source, Sink): 3A, 3A
• Input Type: Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 28ns, 32ns
• Operating Temperature: 0°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

AT28HC64B-90PC

Microchip Technology

IC EEPROM 64KBIT 90NS 28DIP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 64Kb (8K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 90ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Through Hole
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-PDIP

package: 28-DIP (0.600", 15.24mm)

93AA46BX-I/SN

Microchip Technology

IC EEPROM 1KBIT 2MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (64 x 16)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 6ms
• Access Time: -
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

SY89207LKG TR

Microchip Technology

IC AMP PECL 3.3V 800MHZ 10-MSOP

• Type: Differential Receiver
• Applications: Crystal Oscillator
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-MSOP

package: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

ATTINY11-6SI

Microchip Technology

IC MCU 8BIT 1KB FLASH 8SOIC

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 6MHz
• Connectivity: -
• Peripherals: WDT
• Number of I/O: 6
• Program Memory Size: 1KB (512 x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.209", 5.30mm Width)

PIC24FV08KM204-E/MV

Microchip Technology

IC MCU 16BIT 8KB FLASH 48UQFN

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 37
• Program Memory Size: 8KB (2.75K x 24)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5 V
• Data Converters: A/D 22x10b/12b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-UFQFN Exposed Pad
• Supplier Device Package: 48-UQFN (6x6)

package: 48-UFQFN Exposed Pad

PIC16C55A-40/SP

Microchip Technology

IC MCU 8BIT 768B OTP 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 20
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 25 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

PIC16LF1782-I/ML

Microchip Technology

IC MCU 8BIT 3.5KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PSMC, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

package: 28-VQFN Exposed Pad

PIC24FJ16GA002-I/SP

Microchip Technology

IC MCU 16BIT 16KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 16KB (5.5K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

PIC18F2585-I/SO

Microchip Technology

IC MCU 8BIT 48KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 3.25K x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

AR1011T-I/ML

Microchip Technology

IC CTRLR TOUCH SENSE 20QFN

• Touchscreen: 4, 5, or 8 Wire Resistive
• Resolution (Bits): 10 b
• Interface: UART
• Voltage Reference: -
• Voltage - Supply: 2.5 V ~ 5 V
• Current - Supply: 17mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (4x4)

package: 20-VFQFN Exposed Pad

MCP4261-103E/P

Microchip Technology

IC DGTL POT 10K 2CH 14DIP

• Taper: Linear
• Configuration: Potentiometer
• Number of Circuits: 2
• Number of Taps: 257
• Resistance (Ohms): 10k
• Interface: SPI
• Memory Type: Non-Volatile
• Voltage - Supply: 1.8 V ~ 5.5 V
• Features: -
• Tolerance: ±20%
• Temperature Coefficient (Typ): 150 ppm/°C
• Resistance - Wiper (Ohms) (Typ): 75
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-PDIP

package: 14-DIP (0.300", 7.62mm)

SY10E111JC

Microchip Technology

IC CLK BUFFER 1:9 28PLCC

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:9
• Differential - Input:Output: Yes/Yes
• Input: PECL
• Output: PECL
• Frequency - Max: -
• Voltage - Supply: 4.2 V ~ 5.5 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.51x11.51)

package: 28-LCC (J-Lead)

CAP1298-1-SL

Microchip Technology

8-CHANNEL CAPACITIVE TOUCH SENSO

• Type: Buttons
• Proximity Detection: Yes
• Number of Inputs: 8
• LED Driver Channels: -
• Interface: I2C, SMBus
• Resolution: 8 b
• Voltage - Supply: 3 V ~ 5.5 V
• Current - Supply: 750µA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

package: 14-SOIC (0.154", 3.90mm Width)

ATSAMA5D28C-LD1G-CU

Microchip Technology

CORTEX-A5 MPU 1GBIT LPDDR2 BGA I

• Core Processor: ARM® Cortex®-A5
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 500MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keyboard, LCD, Touchscreen
• Ethernet: 10/100Mbps (1)
• SATA: -
• USB: USB 2.0 + HSIC
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

package: 289-LFBGA

1N5265-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 62 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 185 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 45 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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UM7104SM

Microchip Technology

SI PPIN HERMETIC MELF

• Diode Type: -
• Voltage - Peak Reverse (Max): -
• Current - Max: -
• Capacitance @ Vr, F: -
• Resistance @ If, F: -
• Power Dissipation (Max): -
• Operating Temperature: -
• Package / Case: SQ-MELF
• Supplier Device Package: -

package: -

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JANHCA1N4621D

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 3.6 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1700 Ohms
• Current - Reverse Leakage @ Vr: 7.5 µA @ 2 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

package: -

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2N5794U-TR

Microchip Technology

TRANSISTOR DUAL SMALL-SIGNAL BJT

• Transistor Type: 2 NPN (Dual)
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: 900mV @ 30mA, 300mA
• Current - Collector Cutoff (Max): 10µA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Supplier Device Package: 6-SMD

package: -

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JANTXV2N335A

Microchip Technology

TRANS NPN 45V 0.01A TO5

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 10 mA
• Voltage - Collector Emitter Breakdown (Max): 45 V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-205AA, TO-5-3 Metal Can
• Supplier Device Package: TO-5AA

package: -

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JANS1N4121CUR-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 33 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 25.1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

package: -

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JANTXV1N6316CUS

Microchip Technology

DIODE ZENER 4.7V 500MW MELF

• Voltage - Zener (Nom) (Vz): 4.7 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 17 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

package: -

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MPFS095TLS-FCSG325I

Microchip Technology

IC SOC RISC-V 325LFBGA

• Architecture: MPU, FPGA
• Core Processor: RISC-V
• Flash Size: 128KB
• RAM Size: 857.6kB
• Peripherals: DMA, PCI, PWM
• Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Speed: -
• Primary Attributes: FPGA - 93K Logic Modules
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 325-LFBGA
• Supplier Device Package: 325-LFBGA (11x14.5)

package: -

S20450

Microchip Technology

STD RECTIFIER

• Diode Type: -
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: -
• Speed: -
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -
• Operating Temperature - Junction: -

package: -

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JANTX1N6840U3

Microchip Technology

DIODE SCHOTTKY 35V 10A U3

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 35 V
• Current - Average Rectified (Io): 10A
• Voltage - Forward (Vf) (Max) @ If: 880 mV @ 20 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: 3-SMD, No Lead
• Supplier Device Package: U3 (SMD-0.5)
• Operating Temperature - Junction: -65°C ~ 150°C

package: -

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PIC32CM2532JH00064T-I-PT

Microchip Technology

IC MCU 32BIT 256KB FLASH 64TQFP

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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