Microchip Technology Producten

DSC1121AM1-100.0000T

Microchip Technology

OSC MEMS 100.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 100MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -55°C ~ 125°C
• Current - Supply (Max): 35mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead, Exposed Pad

DSC1001CC1-024.0000

Microchip Technology

OSC MEMS 24.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 24MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: 0°C ~ 70°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

DSC1001BE5-064.0000

Microchip Technology

OSC MEMS 64.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 64MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±10ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

MIC2198BML

Microchip Technology

IC REG CTRLR BUCK 12MLF

• Output Type: Transistor Driver
• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Number of Outputs: 1
• Output Phases: 1
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 32 V
• Frequency - Switching: 500kHz
• Duty Cycle (Max): 76%
• Synchronous Rectifier: Yes
• Clock Sync: No
• Serial Interfaces: -
• Control Features: Enable
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 12-VFDFN Exposed Pad, 12-MLF?
• Supplier Device Package: 12-MLF? (4x4)

package: 12-VFDFN Exposed Pad, 12-MLF?

MIC4428YMM

Microchip Technology

IC DRIVER MOSFET 1.5A DUAL 8MSOP

• Driven Configuration: Low-Side
• Channel Type: Independent
• Number of Drivers: 2
• Gate Type: N-Channel, P-Channel MOSFET
• Voltage - Supply: 4.5 V ~ 18 V
• Logic Voltage - VIL, VIH: 0.8V, 2.4V
• Current - Peak Output (Source, Sink): 1.5A, 1.5A
• Input Type: Inverting, Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 20ns, 29ns
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

HV5812PJ-G-M904

Microchip Technology

IC DISPLAY DVR 20CH 80V 28PLCC

• Display Type: Vacuum Fluorescent (VF)
• Configuration: -
• Interface: Serial
• Digits or Characters: -
• Current - Supply: 100µA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.5x11.5)

package: 28-LCC (J-Lead)

24AA64T-I/OT

Microchip Technology

IC EEPROM 64KBIT 400KHZ SOT23-5

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 64Kb (8K x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 900ns
• Voltage - Supply: 1.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

package: SC-74A, SOT-753

SY10EP31VKG

Microchip Technology

IC D-TYPE POS TRG SNGL 8MSOP

• Function: Set(Preset) and Reset
• Type: D-Type
• Output Type: Differential
• Number of Elements: 1
• Number of Bits per Element: 1
• Clock Frequency: 3GHz
• Max Propagation Delay @ V, Max CL: -
• Trigger Type: Positive Edge
• Current - Output High, Low: -
• Voltage - Supply: -3 V ~ -5.5 V
• Current - Quiescent (Iq): 45mA
• Input Capacitance: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

ATA6621-PGQW

Microchip Technology

IC TXRX LIN BUS 5V/50MA 20QFN

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 30mV
• Data Rate: -
• Voltage - Supply: 5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-VQFN Exposed Pad
• Supplier Device Package: 20-QFN (5x5)

package: 20-VQFN Exposed Pad

AT91SAM7S128C-AU-999

Microchip Technology

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 55MHz
• Connectivity: I2C, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

PIC16F723AT-I/SO

Microchip Technology

IC MCU 8BIT 7KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 11x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

PIC12LF1501-E/SN

Microchip Technology

IC MCU 8BIT 1.75KB FLASH 8SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 5
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

MCP4132T-104E/SN

Microchip Technology

IC RHEO DGTL SNGL 100K SPI 8SOIC

• Taper: Linear
• Configuration: Rheostat
• Number of Circuits: 1
• Number of Taps: 129
• Resistance (Ohms): 100k
• Interface: SPI
• Memory Type: Volatile
• Voltage - Supply: 1.8 V ~ 5.5 V
• Features: -
• Tolerance: ±20%
• Temperature Coefficient (Typ): 150 ppm/°C
• Resistance - Wiper (Ohms) (Typ): 75
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

PL585-P8-078OC

Microchip Technology

IC CLK BUFFER LVPECL 16TSSOP

• Type: -
• PLL: Yes
• Input: Crystal
• Output: LVCMOS, LVDS, LVPECL
• Number of Circuits: 1
• Ratio - Input:Output: 1:2
• Differential - Input:Output: No/No
• Frequency - Max: 266.67MHz
• Divider/Multiplier: Yes/Yes
• Voltage - Supply: 2.97 V ~ 3.63 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

ATA8205P6-TKQY

Microchip Technology

IC RCVR ASK/FSK UHF 868MHZ 20SSO

• Frequency: 868MHz
• Sensitivity: -111dBm
• Data Rate (Max): 10 kbps
• Modulation or Protocol: ASK, FSK
• Applications: General Purpose
• Current - Receiving: 8.5mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: RSSI Equipped
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSO

package: 20-LSSOP (0.173", 4.40mm Width)

ATSAME70N19B-CN

Microchip Technology

CM7,512KB FLASH,256KB SRAM,BGA10

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 300MHz
• Connectivity: CANbus, Ethernet, I²C, IrDA, LINbus, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 75
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 1.7 V ~ 3.6 V
• Data Converters: A/D 10x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (9x9)

package: 100-TFBGA

ZL30683LFG7

Microchip Technology

DUAL CHANNEL SYNCE LINE CARD

• PLL: Yes
• Main Purpose: Ethernet, SONET/SDH, Wireless Base Stations
• Input: CMOS
• Output: CMOS, HCSL, HSTL, LVDS, LVPECL
• Number of Circuits: 3
• Ratio - Input:Output: 5:10
• Differential - Input:Output: Yes/Yes
• Frequency - Max: 1.045GHz
• Voltage - Supply: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 80-VFLGA
• Supplier Device Package: 80-LGA (11x11)

package: -

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CDLL825-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): 6.2 V
• Tolerance: ±4.83%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 15 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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JAN1N990B-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 160 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1.7 Ohms
• Current - Reverse Leakage @ Vr: 500 nA @ 122 V
• Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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MSCSM70TAM19CT3AG

Microchip Technology

SIC 6N-CH 700V 124A SP3F

• FET Type: Silicon Carbide (SiC)
• FET Feature: -
• Drain to Source Voltage (Vdss): 700V
• Current - Continuous Drain (Id) @ 25°C: 124A (Tc)
• Rds On (Max) @ Id, Vgs: 19mOhm @ 40A, 20V
• Vgs(th) (Max) @ Id: 2.4V @ 4mA
• Gate Charge (Qg) (Max) @ Vgs: 215nC @ 20V
• Input Capacitance (Ciss) (Max) @ Vds: 4500pF @ 700V
• Power - Max: 365W (Tc)
• Operating Temperature: -40°C ~ 175°C (TJ)
• Mounting Type: Chassis Mount
• Package / Case: Module
• Supplier Device Package: SP3F

package: -

PIC32MK0256MCJ048-I-Y8X

Microchip Technology

IC MCU 32BIT 256KB FLASH 48TQFP

• Core Processor: MIPS32® microAptiv™
• Core Size: 32-Bit Single-Core
• Speed: 120MHz
• Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
• Number of I/O: 37
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
• Data Converters: A/D 18x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

package: -

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PIC32CX2051MTG128-I-X9B

Microchip Technology

SINGLE CORE, 2MB FLASH, 560KB SR

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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JANKCAL2N3634

Microchip Technology

RH SMALL-SIGNAL BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 1 A
• Voltage - Collector Emitter Breakdown (Max): 140 V
• Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
• Current - Collector Cutoff (Max): 10µA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
• Power - Max: 1 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-205AD, TO-39-3 Metal Can
• Supplier Device Package: TO-39 (TO-205AD)

package: -

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JANTX1N6941UTK3CS-TR

Microchip Technology

DIODE SCHOTTKY 30V 150A THINKEY3

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 30 V
• Current - Average Rectified (Io): 150A
• Voltage - Forward (Vf) (Max) @ If: 500 mV @ 50 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 5 mA @ 30 V
• Capacitance @ Vr, F: 7500pF @ 5V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: ThinKey™3
• Supplier Device Package: ThinKey™3
• Operating Temperature - Junction: -65°C ~ 175°C

package: -

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2N3775

Microchip Technology

POWER BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 1 A
• Voltage - Collector Emitter Breakdown (Max): 60 V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: 5 W
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: Through Hole
• Package / Case: TO-205AA, TO-5-3 Metal Can
• Supplier Device Package: TO-5AA

package: -

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JAN1N3164

Microchip Technology

DIODE GP 200V 300A DO205AB DO9

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 200 V
• Current - Average Rectified (Io): 300A
• Voltage - Forward (Vf) (Max) @ If: 1.55 V @ 940 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 10 mA @ 200 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-205AB, DO-9, Stud
• Supplier Device Package: DO-205AB (DO-9)
• Operating Temperature - Junction: -65°C ~ 200°C

package: -

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JANTX1N6912UTK2-TR

Microchip Technology

DIODE GEN PURP 45V 25A THINKEY2

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 45 V
• Current - Average Rectified (Io): 25A
• Voltage - Forward (Vf) (Max) @ If: 640 mV @ 25 A
• Speed: No Recovery Time > 500mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 1.2 mA @ 45 V
• Capacitance @ Vr, F: 1000pF @ 5V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: ThinKey™2
• Supplier Device Package: ThinKey™2
• Operating Temperature - Junction: -65°C ~ 150°C

package: -

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MSCSM120XM50CTYZBNMG

Microchip Technology

PM-MOSFET-SIC-SBD-6HPD

• FET Type: Silicon Carbide (SiC)
• FET Feature: -
• Drain to Source Voltage (Vdss): 1200V (1.2kV)
• Current - Continuous Drain (Id) @ 25°C: 49A (Tc), 80A (Tc)
• Rds On (Max) @ Id, Vgs: 50mOhm @ 40A, 20V, 31mOhm @ 40A, 20V
• Vgs(th) (Max) @ Id: 2.7V @ 2mA, 2.8V @ 3mA
• Gate Charge (Qg) (Max) @ Vgs: 137nC @ 20V, 232nC @ 20V
• Input Capacitance (Ciss) (Max) @ Vds: 1990pF @ 1000V, 3020pF @ 1000V
• Power - Max: 196W (Tc), 315W (Tc)
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Chassis Mount
• Package / Case: Module
• Supplier Device Package: -

package: -

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