Microchip Technology Producten

DSC1001DL1-033.3333

Microchip Technology

OSC MEMS 33.3333MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 33.3333MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 1.7 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

MIC2214-PMBML-TR

Microchip Technology

IC REG LINEAR 3V/2.8V 10MLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3V, 2.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.25V @ 150mA, 0.42V @ 300mA
• Current - Output: 150mA, 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 80µA
• PSRR: 60dB ~ 40dB (1KHz ~ 20kHz)
• Control Features: Enable, Power On Reset
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad, 10-MLF?
• Supplier Device Package: 10-MLF? (3x3)

package: 10-VFDFN Exposed Pad, 10-MLF?

MIC2951-03BM

Microchip Technology

IC REG LIN POS ADJ 150MA 8SOIC

• Output Configuration: Positive
• Output Type: Adjustable (Fixed)
• Number of Regulators: 1
• Voltage - Input (Max): 30V
• Voltage - Output (Min/Fixed): 1.24V (5V)
• Voltage - Output (Max): 29V
• Voltage Dropout (Max): 0.6V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 300µA ~ 8mA
• PSRR: -
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Reverse Polarity
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

MIC5320-KGYD6-TR

Microchip Technology

IC REG LINEAR 1.8V/2.6V TSOT23-6

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.8V, 2.6V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.1V @ 150mA, 0.1V @ 150mA
• Current - Output: 150mA, 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 120µA ~ 190µA
• PSRR: 65dB ~ 45dB (1kHz ~ 20kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-6 Thin, TSOT-23-6
• Supplier Device Package: TSOT-23-6

package: SOT-23-6 Thin, TSOT-23-6

AT93C66-10PC

Microchip Technology

IC EEPROM 4KBIT 2MHZ 8DIP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Kb (512 x 8, 256 x 16)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 10ms
• Access Time: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

34AA02-E/MS

Microchip Technology

IC EEPROM 2KBIT 400KHZ 8MSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 2Kb (256 x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 900ns
• Voltage - Supply: 1.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

SY10EPT21LZG

Microchip Technology

IC TRANSLATOR LVPECL-LVTTL 8SOIC

• Translator Type: Mixed Signal
• Channel Type: -
• Number of Circuits: -
• Channels per Circuit: -
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: LVPECL
• Output Signal: LVTTL
• Output Type: -
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

SIO1000-JV

Microchip Technology

IC SUPER I/O LPC 64STQFP

• Applications: -
• Interface: LPC
• Voltage - Supply: 3.3V
• Package / Case: 64-LQFP
• Supplier Device Package: 64-STQFP (7x7)
• Mounting Type: Surface Mount

package: 64-LQFP

PIC16C73A-10E/SO

Microchip Technology

IC MCU 8BIT 7KB OTP 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

DSPIC33EP128GM706-H/MR

Microchip Technology

IC MCU 16BIT 128KB FLASH 64QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: -
• Connectivity: CAN, I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: A/D 30x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

package: 64-VFQFN Exposed Pad

PIC32MX230F128HT-50I/MR

Microchip Technology

IC MCU 32BIT 128KB FLASH 64QFN

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 49
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

package: 64-VFQFN Exposed Pad

PIC16C622AT-04/SS

Microchip Technology

IC MCU 8BIT 3.5KB OTP 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 13
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: 20-SSOP (0.209", 5.30mm Width)

PIC16F1716-E/MV

Microchip Technology

IC MCU 8BIT 14KB FLASH 28UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 17x10b, D/A 1x5b, 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-UFQFN Exposed Pad
• Supplier Device Package: 28-UQFN (4x4)

package: 28-UFQFN Exposed Pad

PIC32MM0016GPL036-I/M2

Microchip Technology

IC MCU 32BIT 16KB FLASH 36SQFN

• Core Processor: MIPS32? microAptiv?
• Core Size: 32-Bit
• Speed: 25MHz
• Connectivity: IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, I2S, POR, PWM, WDT
• Number of I/O: 29
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 14x10/12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 36-VFQFN Exposed Pad
• Supplier Device Package: 36-SQFN (6x6)

package: 36-VFQFN Exposed Pad

SY897132LKY-TR

Microchip Technology

IC CLK LINK REPLICATOR HDTV

• PLL: No
• Main Purpose: Fibre Channel, Gigabit Ethernet, HDTV, SATA
• Input: CML, LVPECL
• Output: LVPECL
• Number of Circuits: 1
• Ratio - Input:Output: 3:3
• Differential - Input:Output: Yes/Yes
• Frequency - Max: -
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

package: 28-TSSOP (0.173", 4.40mm Width)

MCP1812AT-018/LT

Microchip Technology

ULTRA LOW IQ LDO

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.6V @ 300mA
• Current - Output: 300mA
• Current - Quiescent (Iq): 0.5µA
• Current - Supply (Max): 220µA
• PSRR: 50dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current
• Operating Temperature: -40°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 5-TSSOP, SC-70-5, SOT-353
• Supplier Device Package: SC-70-5

package: 5-TSSOP, SC-70-5, SOT-353

ATSAMHA1G15A-MBT

Microchip Technology

IC SBC LIN MCU 32KB FLASH 48QFN

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, LINbus SBC, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 0 V ~ 3.8 V
• Data Converters: A/D 13x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TC)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-VQFN (7x7)

package: 48-VFQFN Exposed Pad

PIC16LF18425T-I/SL

Microchip Technology

COMPARATOR, DAC, 12-BIT ADCC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 11
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x12b, D/A 1x5b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

package: 14-SOIC (0.154", 3.90mm Width)

PIC32MZ2048EFG100T-E/GJX

Microchip Technology

2048KB FLASH 512KB RAM NO CRYPTO

• Core Processor: MIPS32® M-Class
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 78
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (7x7)

package: 100-TFBGA

JANTX1N6320C

Microchip Technology

DIODE ZENER 6.8V 500MW DO35

• Voltage - Zener (Nom) (Vz): 6.8 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 3 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 4 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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JANTXV1N4991DUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 240 V
• Tolerance: ±1%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 650 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 182 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: E-MELF

package: -

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MNS1N4567DUR-1-TR

Microchip Technology

TEMPERATURE COMPENSATED

• Voltage - Zener (Nom) (Vz): 6.4 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: 0°C ~ 75°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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1N4148UR-1-TR

Microchip Technology

DIODE GEN PURP 75V 200MA DO213AA

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 75 V
• Current - Average Rectified (Io): 200mA
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 20 ns
• Current - Reverse Leakage @ Vr: 500 nA @ 75 V
• Capacitance @ Vr, F: 4pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA
• Operating Temperature - Junction: -65°C ~ 175°C

package: -

APT20M18B2VFRG

Microchip Technology

MOSFET N-CH 200V 100A T-MAX

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 200 V
• Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): -
• Vgs(th) (Max) @ Id: 4V @ 2.5mA
• Gate Charge (Qg) (Max) @ Vgs: 330 nC @ 10 V
• Input Capacitance (Ciss) (Max) @ Vds: 9880 pF @ 25 V
• Vgs (Max): -
• FET Feature: -
• Power Dissipation (Max): -
• Rds On (Max) @ Id, Vgs: 18mOhm @ 50A, 10V
• Operating Temperature: -
• Mounting Type: Through Hole
• Supplier Device Package: T-MAX™ [B2]
• Package / Case: TO-247-3 Variant

package: -

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1N486BUR-TR

Microchip Technology

SIGNAL OR COMPUTER DIODE

• Diode Type: -
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: -
• Speed: -
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -
• Operating Temperature - Junction: -

package: -

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JAN1N3045DUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 110 V
• Tolerance: ±1%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 450 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 83.6 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -55°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF (Glass)
• Supplier Device Package: DO-213AB (MELF, LL41)

package: -

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JANS1N5616US-TR

Microchip Technology

DIODE GEN PURP 400V 1A A SQ-MELF

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 400 V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 3 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 2 µs
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: A, SQ-MELF
• Operating Temperature - Junction: -65°C ~ 200°C

package: -

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1N6766R

Microchip Technology

DIODE ARRAY GP 400V 12A TO254AA

• Diode Configuration: 1 Pair Common Anode
• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 400 V
• Current - Average Rectified (Io) (per Diode): 12A (DC)
• Voltage - Forward (Vf) (Max) @ If: 1.55 V @ 12 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 60 ns
• Current - Reverse Leakage @ Vr: 10 µA @ 320 V
• Operating Temperature - Junction: -55°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: TO-254-3, TO-254AA
• Supplier Device Package: TO-254AA

package: -

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