Microchip Technology Producten

DSC1104DI1-100.0000T

Microchip Technology

OSC MEMS 100.000MHZ HCSL SMD

• Type: MEMS (Silicon)
• Frequency: 100MHz
• Function: Standby (Power Down)
• Output: HCSL
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 42mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead

DSC1101CM2-024.5454T

Microchip Technology

OSC MEMS 24.5454MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 24.5454MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -55°C ~ 125°C
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead

DSC1122AI2-025.0000

Microchip Technology

OSC MEMS 25.0000MHZ LVPECL SMD

• Type: MEMS (Silicon)
• Frequency: 25MHz
• Function: Enable/Disable
• Output: LVPECL
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 58mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead, Exposed Pad

DSC1001DI1-025.0008

Microchip Technology

OSC MEMS 25.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 25.0008MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

DSC1001DI2-049.1520

Microchip Technology

OSC MEMS 49.152MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 49.152MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

TN5325N8-G

Microchip Technology

MOSFET N-CH 250V 0.316A SOT89-3

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 250V
• Current - Continuous Drain (Id) @ 25°C: 316mA (Tj)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 110pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 1.6W (Ta)
• Rds On (Max) @ Id, Vgs: 7 Ohm @ 1A, 10V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Supplier Device Package: TO-243AA (SOT-89)
• Package / Case: TO-243AA

package: TO-243AA

TS68882VR25

Microchip Technology

IC FLOAT-PT CO-PROC 25MHZ 68PGA

• Type: Floating-Point Co-Processor
• Applications: -
• Mounting Type: Through Hole
• Package / Case: 68-CPGA
• Supplier Device Package: 68-CPGA (26.92x26.92)

package: 68-CPGA

MIC5504-3.3YMT-T5

Microchip Technology

IC REG LINEAR 3.3V 300MA 4TDFN

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.38V @ 300mA
• Current - Output: 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 55µA ~ 65µA
• PSRR: 60dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 4-UDFN Exposed Pad
• Supplier Device Package: 4-TDFN (1x1)

package: 4-UDFN Exposed Pad

AT27C040-12RI

Microchip Technology

IC OTP 4MBIT 120NS 32SOIC

• Memory Type: Non-Volatile
• Memory Format: EPROM
• Technology: EPROM - OTP
• Memory Size: 4Mb (512K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: -
• Access Time: 120ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-SOIC (0.445", 11.30mm Width)
• Supplier Device Package: 32-SOIC

package: 32-SOIC (0.445", 11.30mm Width)

AT28C256E-20UM/883

Microchip Technology

IC EEPROM 256KBIT 200NS 28CPGA

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 256Kb (32K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 200ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C (TC)
• Mounting Type: Through Hole
• Package / Case: 28-BCPGA
• Supplier Device Package: 28-CPGA (13.55x15.06)

package: 28-BCPGA

SST26WF040BT-104I/SN

Microchip Technology

IC FLASH 4MBIT 104MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 4Mb (512K x 8)
• Memory Interface: SPI - Quad I/O
• Clock Frequency: 104MHz
• Write Cycle Time - Word, Page: 1.5ms
• Access Time: -
• Voltage - Supply: 1.65 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

SY100EL16VBKG

Microchip Technology

IC RCVR DIFF 3.3/5V 8-MSOP

• Logic Type: Differential Receiver
• Supply Voltage: 3.3V, 5V
• Number of Bits: 1
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MCP6546UT-I/LT

Microchip Technology

IC COMP 1.6V SNGL O-D SC70-5

• Type: General Purpose
• Number of Elements: 1
• Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
• Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
• Voltage - Input Offset (Max): 7mV @ 5.5V
• Current - Input Bias (Max): 1pA @ 5.5V
• Current - Output (Typ): 30mA
• Current - Quiescent (Max): 1µA
• CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
• Propagation Delay (Max): 8µs
• Hysteresis: 6.5mV
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 5-TSSOP, SC-70-5, SOT-353
• Mounting Type: Surface Mount
• Supplier Device Package: SC-70-5

package: 5-TSSOP, SC-70-5, SOT-353

TS87C54X2-LCE

Microchip Technology

IC MCU 8BIT 16KB OTP 44VQFP

• Core Processor: 80C51
• Core Size: 8-Bit
• Speed: 30/20MHz
• Connectivity: UART/USART
• Peripherals: POR, WDT
• Number of I/O: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: -

package: 44-QFP

PIC32MX550F256H-V/MR

Microchip Technology

IC MCU 32BIT 256KB FLASH 64QFN

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 49
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

package: 64-VFQFN Exposed Pad

PIC16F1516T-I/SO

Microchip Technology

IC MCU 8BIT 14KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 17x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

PIC16LF1566-E/MV

Microchip Technology

IC MCU 8BIT 14KB FLASH 28UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 23x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-UFQFN
• Supplier Device Package: 28-UQFN (4x4)

package: 28-UFQFN

PL602-39QC-R

Microchip Technology

IC CLK BUFFER 800MHZ 16QFN

• Type: -
• PLL: Yes with Bypass
• Input: Crystal
• Output: LVDS
• Number of Circuits: 1
• Ratio - Input:Output: 1:1
• Differential - Input:Output: No/Yes
• Frequency - Max: 800MHz
• Divider/Multiplier: Yes/Yes
• Voltage - Supply: 2.97 V ~ 3.63 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-QFN (3x3)

package: 16-VFQFN Exposed Pad

JANTX2N6676T1

Microchip Technology

TRANS NPN 300V 15A TO254

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 15 A
• Voltage - Collector Emitter Breakdown (Max): 300 V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-254-3, TO-254AA
• Supplier Device Package: TO-254

package: -

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PIC16F17174T-I-MP

Microchip Technology

7KB FLASH, 512B RAM, 128B EEPROM

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 7KB (7K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 58x12b; D/A 2x8b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

package: -

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GC9703-00

Microchip Technology

DIODE SCHOTTKY 8V 10MA CHIP

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 8 V
• Current - Average Rectified (Io): 10mA
• Voltage - Forward (Vf) (Max) @ If: 350 mV @ 1 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 100 nA @ 1 V
• Capacitance @ Vr, F: 1.2pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip
• Operating Temperature - Junction: -55°C ~ 150°C

package: -

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1011GN-250V

Microchip Technology

RF MOSFET GAN 50V 55-QP

• Transistor Type: GaN
• Frequency: 1.03GHz ~ 1.09GHz
• Gain: 20.5dB
• Voltage - Test: 50 V
• Current Rating: -
• Noise Figure: -
• Current - Test: 60 mA
• Power - Output: 280W
• Voltage - Rated: 125 V
• Package / Case: 55-QP
• Supplier Device Package: 55-QP

package: -

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MPFS160T-1FCVG784E

Microchip Technology

IC SOC RISC-V 784FCBGA

• Architecture: MPU, FPGA
• Core Processor: RISC-V
• Flash Size: 128kB
• RAM Size: 1.4125MB
• Peripherals: DMA, PCI, PWM
• Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Speed: -
• Primary Attributes: FPGA - 161K Logic Modules
• Operating Temperature: 0°C ~ 100°C
• Package / Case: 784-BFBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

package: -

CD6349

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: -
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

package: -

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R50430

Microchip Technology

STD RECTIFIER

• Diode Type: -
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: -
• Speed: -
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -
• Operating Temperature - Junction: -

package: -

Request a Quote

JANTX1N4118D-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 27 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 150 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 20.5 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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UZ8213

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 130 V
• Tolerance: ±10%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 700 Ohms
• Current - Reverse Leakage @ Vr: 500 nA @ 93.6 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: A, Axial
• Supplier Device Package: A, Axial

package: -

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USB7016T-I-KDX

Microchip Technology

USB3.1 GEN1 HUB WITHOUT PD, 1CC,

• Protocol: USB
• Function: Hub Controller
• Interface: GPIO, I2C, SPI, USB
• Standards: USB 2.0, USB 3.2
• Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 100-VFQFN Exposed Pad
• Supplier Device Package: 100-VQFN (12x12)

package: -