Microchip Technology Producten

DSC1104DE1-100.0000

Microchip Technology

OSC MEMS 100.0000MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 100MHz
• Function: Standby (Power Down)
• Output: HCSL
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 42mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead

HCS360-I/P

Microchip Technology

IC CODE HOPP ENCODER 15FUNC 8DIP

• Type: Code Hopping Encoder
• Applications: Remote Secure Access, Keyless Entry
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

TC4421VAT

Microchip Technology

IC MOSFET DRIVER 9A INV TO220-5

• Driven Configuration: Low-Side
• Channel Type: Single
• Number of Drivers: 1
• Gate Type: IGBT, N-Channel, P-Channel MOSFET
• Voltage - Supply: 4.5 V ~ 18 V
• Logic Voltage - VIL, VIH: 0.8V, 2.4V
• Current - Peak Output (Source, Sink): 9A, 9A
• Input Type: Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 60ns, 60ns
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-220-5
• Supplier Device Package: TO-220-5

package: TO-220-5

AT49F001N-90VI

Microchip Technology

IC FLASH 1MBIT 90NS 32VSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 1Mb (128K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 50µs
• Access Time: 90ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-TFSOP (0.488", 12.40mm Width)
• Supplier Device Package: 32-VSOP

package: 32-TFSOP (0.488", 12.40mm Width)

AT49F001-90PI

Microchip Technology

IC FLASH 1MBIT 90NS 32DIP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 1Mb (128K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 50µs
• Access Time: 90ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Through Hole
• Package / Case: 32-DIP (0.600", 15.24mm)
• Supplier Device Package: 32-DIP

package: 32-DIP (0.600", 15.24mm)

AT28HC256-12PC

Microchip Technology

IC EEPROM 256KBIT 120NS 28DIP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 256Kb (32K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 120ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Through Hole
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-PDIP

package: 28-DIP (0.600", 15.24mm)

23A1024T-E/SN

Microchip Technology

IC SRAM 1MBIT 20MHZ 8SOIC

• Memory Type: Volatile
• Memory Format: SRAM
• Technology: SRAM
• Memory Size: 1Mb (128K x 8)
• Memory Interface: SPI - Quad I/O
• Clock Frequency: 16MHz
• Write Cycle Time - Word, Page: -
• Access Time: -
• Voltage - Supply: 1.7 V ~ 2.2 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

PIC24FV32KA302-E/ML

Microchip Technology

IC MCU 16BIT 32KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 32KB (11K x 24)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 13x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

package: 28-VQFN Exposed Pad

DSPIC33FJ06GS202-E/MM

Microchip Technology

IC MCU 16BIT 6KB FLASH 28QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 6KB (6K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b, D/A 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN-S (6x6)

package: 28-VQFN Exposed Pad

ATSAMD21E15L-AFT

Microchip Technology

IC MCU 32BIT 32KB FLASH 32TQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 10x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-TQFP
• Supplier Device Package: 32-TQFP (7x7)

package: 32-TQFP

PIC18F66J60-I/PT

Microchip Technology

IC MCU 8BIT 64KB FLASH 64TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 41.667MHz
• Connectivity: Ethernet, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3808 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

package: 64-TQFP

PIC24FV08KM202-I/ML

Microchip Technology

IC MCU 16BIT 8KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 8KB (2.75K x 24)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5 V
• Data Converters: A/D 19x10b/12b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

package: 28-VQFN Exposed Pad

ATTINY43U-SU

Microchip Technology

IC MCU 8BIT 4KB FLASH 20SOIC

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: USI
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number of I/O: 16
• Program Memory Size: 4KB (2K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 64 x 8
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

MCP45HV31-502E/MQ

Microchip Technology

IC DGTL POT 5K 128TAPS 20QFN

• Taper: Linear
• Configuration: Potentiometer
• Number of Circuits: 1
• Number of Taps: 128
• Resistance (Ohms): 5k
• Interface: I2C
• Memory Type: Volatile
• Voltage - Supply: 1.8 V ~ 5.5 V, 10 V ~ 36 V, ±5V ~ 18 V
• Features: Selectable Address
• Tolerance: ±20%
• Temperature Coefficient (Typ): 100 ppm/°C
• Resistance - Wiper (Ohms) (Typ): 145
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-VQFN Exposed Pad
• Supplier Device Package: 20-QFN (5x5)

package: 20-VQFN Exposed Pad

HUM2010B

Microchip Technology

SI PPIN HERMETIC GLASS AXIAL

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 1000V
• Current - Max: -
• Capacitance @ Vr, F: 4pF @ 100V, 1MHz
• Resistance @ If, F: 200mOhm @ 500mA, 4MHz
• Power Dissipation (Max): 13 W
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Axial
• Supplier Device Package: Axial

package: -

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AVR32DD28-I-SO

Microchip Technology

IC MCU 8BIT 32KB FLASH 28SOIC

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 19x12b SAR; D/A 1x10b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: -

1N2254A

Microchip Technology

DIODE GEN PURP 400V 22A DO4

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 400 V
• Current - Average Rectified (Io): 22A
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 10 µA @ 400 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AA, DO-4, Stud
• Supplier Device Package: DO-4 (DO-203AA)
• Operating Temperature - Junction: -65°C ~ 200°C

package: -

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JANTX1N5541D-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 22 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 19.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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LAN8670C2-E-LMX

Microchip Technology

10BASE-T1S PHY WITH MII/RMII

• Type: Transceiver
• Protocol: Ethernet
• Number of Drivers/Receivers: 1/1
• Duplex: Full, Half
• Receiver Hysteresis: 230 mV
• Data Rate: 10Mbps
• Voltage - Supply: 3.135V ~ 3.465V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-VQFN (5x5)

package: -

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APT10025JVFR

Microchip Technology

MOSFET N-CH 1000V 34A ISOTOP

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 1000 V
• Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): -
• Vgs(th) (Max) @ Id: 4V @ 5mA
• Gate Charge (Qg) (Max) @ Vgs: 990 nC @ 10 V
• Input Capacitance (Ciss) (Max) @ Vds: 18000 pF @ 25 V
• Vgs (Max): -
• FET Feature: -
• Power Dissipation (Max): -
• Rds On (Max) @ Id, Vgs: 250mOhm @ 500mA, 10V
• Operating Temperature: -
• Mounting Type: Chassis Mount
• Supplier Device Package: ISOTOP®
• Package / Case: SOT-227-4, miniBLOC

package: -

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1N6003B-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 13 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 25 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 9.9 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-35

package: -

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MCP8022T-3315H-NHX

Microchip Technology

3-PHASE BRUSHLESS DC MOTOR GATE

• Motor Type - Stepper: Multiphase
• Motor Type - AC, DC: Brushless DC (BLDC)
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Pre-Driver - Half Bridge (3)
• Interface: PWM
• Technology: NMOS
• Step Resolution: -
• Applications: -
• Current - Output: 500mA
• Voltage - Supply: 4.5V ~ 40V
• Voltage - Load: 12V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-VQFN (5x5)

package: -

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JANSM2N3501L

Microchip Technology

RH SMALL-SIGNAL BJT

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 300 mA
• Voltage - Collector Emitter Breakdown (Max): 150 V
• Vce Saturation (Max) @ Ib, Ic: 400mV @ 15mA, 150mA
• Current - Collector Cutoff (Max): 10µA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
• Power - Max: 1 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-205AA, TO-5-3 Metal Can
• Supplier Device Package: TO-5AA

package: -

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JANTXV1N3317RB

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 18 V
• Tolerance: ±5%
• Power - Max: 50 W
• Impedance (Max) (Zzt): 2 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5

package: -

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1N646-TR

Microchip Technology

DIODE GEN PURP 300V 400MA DO35

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 300 V
• Current - Average Rectified (Io): 400mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 400 mA
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 200 nA @ 300 V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)
• Operating Temperature - Junction: -65°C ~ 175°C

package: -

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APT5018SLLG

Microchip Technology

MOSFET N-CH 500V 27A D3PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 500 V
• Current - Continuous Drain (Id) @ 25°C: 27A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): -
• Vgs(th) (Max) @ Id: 5V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 58 nC @ 10 V
• Input Capacitance (Ciss) (Max) @ Vds: 2596 pF @ 25 V
• Vgs (Max): -
• FET Feature: -
• Power Dissipation (Max): -
• Rds On (Max) @ Id, Vgs: 180mOhm @ 13.5A, 10V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Supplier Device Package: D3PAK
• Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA

package: -

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R504160TS

Microchip Technology

DIODE GP REV 1.6KV 300A DO205AB

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 1600 V
• Current - Average Rectified (Io): 300A
• Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1000 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 75 µA @ 1600 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-205AB, DO-9, Stud
• Supplier Device Package: DO-205AB (DO-9)
• Operating Temperature - Junction: -65°C ~ 200°C

package: -

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DSC612PI2A-014J

Microchip Technology

IC CLOCK GENERATOR 6VFLGA

• Type: Clock Generator
• PLL: Yes
• Input: -
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 2:2
• Differential - Input:Output: No/No
• Frequency - Max: 100MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 1.71V ~ 3.63V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-VFLGA
• Supplier Device Package: 6-VFLGA (1.6x1.2)

package: -

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