Microchip Technology Producten

DSC1001DI5-002.0000T

Microchip Technology

OSC MEMS 2.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 2MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

DSC1001AE1-025.0000T

Microchip Technology

OSC MEMS 25.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 25MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead Exposed Pad

MIC5305-3.0BD5

Microchip Technology

IC REG LINEAR 3V 150MA TSOT23-5

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.85V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 150µA
• PSRR: 85dB ~ 65dB (1kHz ~ 10kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-5 Thin, TSOT-23-5
• Supplier Device Package: TSOT-23-5

package: SOT-23-5 Thin, TSOT-23-5

SST39LF802C-55-4C-MAQE-T

Microchip Technology

IC FLASH 8MBIT 55NS 48WFBGA

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 8Mb (512K x 16)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10µs
• Access Time: 55ns
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-WFBGA
• Supplier Device Package: 48-WFBGA (6x4)

package: 48-WFBGA

24LCS21A/P

Microchip Technology

IC EEPROM 1KBIT 400KHZ 8DIP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (128 x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 10ms
• Access Time: 900ns
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

SY10EL52ZG TR

Microchip Technology

IC D-TYPE POS/NEG 8SOIC

• Function: Standard
• Type: D-Type
• Output Type: Differential
• Number of Elements: 1
• Number of Bits per Element: 1
• Clock Frequency: 2.8GHz
• Max Propagation Delay @ V, Max CL: -
• Trigger Type: Positive, Negative
• Current - Output High, Low: -
• Voltage - Supply: -4.75 V ~ -5.5 V
• Current - Quiescent (Iq): 25mA
• Input Capacitance: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)

package: 8-SOIC (0.154", 3.90mm Width)

ATF22LV10C-10SC

Microchip Technology

IC PLD 10MC 10NS 24SOIC

• Programmable Type: EE PLD
• Number of Macrocells: 10
• Voltage - Input: 3.3V
• Speed: 10ns
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SOIC

package: 24-SOIC (0.295", 7.50mm Width)

DSPIC33FJ16GP102-E/SP

Microchip Technology

IC MCU 16BIT 16KB FLASH 28SDIP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 16 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

PIC24EP256GU814T-I/PL

Microchip Technology

IC MCU 16BIT 256KB FLASH 144LQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 122
• Program Memory Size: 256KB (85.5K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

PIC24HJ128GP510-I/PT

Microchip Technology

IC MCU 16BIT 128KB FLASH 100TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (12x12)

package: 100-TQFP

DSPIC33EP512MC502-E/SO

Microchip Technology

IC MCU 16BIT 512KB FLASH 28SOIC

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 512KB (170K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 24K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

PIC32MX450F256L-120/PF

Microchip Technology

IC MCU 32BIT 256KB FLASH 100TQFP

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 81
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

package: 100-TQFP

PIC16F1788-I/SS

Microchip Technology

IC MCU 8BIT 28KB FLASH 28SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PSMC, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 28KB (16K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 11x12b, D/A 1x8b, 3x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

package: 28-SSOP (0.209", 5.30mm Width)

PIC18F6490-I/PT

Microchip Technology

IC MCU 8BIT 16KB FLASH 64TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, LCD, POR, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

package: 64-TQFP

PIC16F818-I/P

Microchip Technology

IC MCU 8BIT 1.75KB FLASH 18DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 18-DIP (0.300", 7.62mm)
• Supplier Device Package: 18-PDIP

package: 18-DIP (0.300", 7.62mm)

MCP4661-502E/ST

Microchip Technology

IC DGTL POT 5K 257TAPS 14-TSSOP

• Taper: Linear
• Configuration: Potentiometer
• Number of Circuits: 2
• Number of Taps: 257
• Resistance (Ohms): 5k
• Interface: I2C
• Memory Type: Non-Volatile
• Voltage - Supply: 1.8 V ~ 5.5 V
• Features: Mute, Selectable Address
• Tolerance: ±20%
• Temperature Coefficient (Typ): 150 ppm/°C
• Resistance - Wiper (Ohms) (Typ): 75
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

package: 14-TSSOP (0.173", 4.40mm Width)

MCP3202T-CI/ST

Microchip Technology

IC ADC 12BIT 2.7V 2CH SPI 8TSSOP

• Number of Bits: 12
• Sampling Rate (Per Second): 100k
• Number of Inputs: 1, 2
• Input Type: Pseudo-Differential, Single Ended
• Data Interface: SPI
• Configuration: S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: SAR
• Reference Type: External
• Voltage - Supply, Analog: 2.7 V ~ 5.5 V
• Voltage - Supply, Digital: 2.7 V ~ 5.5 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP
• Mounting Type: -

package: 8-TSSOP (0.173", 4.40mm Width)

SST12LF03-Q3DE

Microchip Technology

IC MOD FEM 11B/G/N BT 20-UQFN

• RF Type: Bluetooth, Zigbee
• Frequency: 2.4GHz
• Features: -
• Package / Case: 20-UFQFN Exposed Pad
• Supplier Device Package: 20-UQFN (3x3)

package: 20-UFQFN Exposed Pad

ATA663201-GBQW

Microchip Technology

3.3V LDO

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

PIC32MZ1024EFG100-E/GJX

Microchip Technology

1024KB FLASH 512KB RAM NO CRYPTO

• Core Processor: MIPS32® M-Class
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 78
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (7x7)

package: 100-TFBGA

DSPIC33CK128MC502-I-2N

Microchip Technology

IC MCU 16BIT 128KB FLASH 28UQFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 28-UQFN Exposed Pad
• Supplier Device Package: 28-UQFN (6x6)

package: -

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S35100

Microchip Technology

DIODE GEN PURP 1KV 70A DO5

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 1000 V
• Current - Average Rectified (Io): 70A
• Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 25 µA @ 1000 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5 (DO-203AB)
• Operating Temperature - Junction: -65°C ~ 200°C

package: -

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S3240

Microchip Technology

STD RECTIFIER

• Diode Type: -
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: -
• Speed: -
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -
• Operating Temperature - Junction: -

package: -

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CDLL5227B-TR

Microchip Technology

DIODE ZENER 3.6V DO-213AB

• Voltage - Zener (Nom) (Vz): 3.6 V
• Tolerance: ±5%
• Power - Max: -
• Impedance (Max) (Zzt): 24 Ohms
• Current - Reverse Leakage @ Vr: 15 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF
• Supplier Device Package: DO-213AB

package: -

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ATMXT228UD-MAUR002

Microchip Technology

MAXTOUCH UD SERIES, 228 CHANNEL

• Touchscreen: -
• Resolution (Bits): -
• Interface: I2C, SPI
• Voltage Reference: -
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-XFQFN Exposed Pad
• Supplier Device Package: 56-XQFN (6x6)

package: -

1N5712-1E3

Microchip Technology

DIODE SCHOTTKY 20V 75MA DO35

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 20 V
• Current - Average Rectified (Io): 75mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 150 nA @ 16 V
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)
• Operating Temperature - Junction: -65°C ~ 150°C

package: -

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JANTX1N4959US-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 11 V
• Tolerance: ±5%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 2.5 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: D-5B

package: -

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MV31011-150A-TR

Microchip Technology

GAAS TVAR NON HERMETIC EPSM SMT

• Capacitance @ Vr, F: 0.5pF @ 4V, 1MHz
• Capacitance Ratio: 5.5
• Capacitance Ratio Condition: C2/C20
• Voltage - Peak Reverse (Max): 22 V
• Diode Type: Single
• Q @ Vr, F: 4000 @ 4V, 50MHz
• Operating Temperature: -55°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

package: -

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