Microchip Technology Producten

DSC1101CI2-066.0000

Microchip Technology

OSC MEMS 66.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 66MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead

DSC1001AE2-125.0000

Microchip Technology

OSC MEMS 125.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 125MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 8.7mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead Exposed Pad

DSC1001CI2-050.0000T

Microchip Technology

OSC MEMS 50.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 50MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

LM4040CYM3-4.1-TR

Microchip Technology

IC VREF SHUNT 4.096V SOT23

• Reference Type: Shunt
• Output Type: Fixed
• Voltage - Output (Min/Fixed): 4.096V
• Voltage - Output (Max): -
• Current - Output: 15mA
• Tolerance: ±0.5%
• Temperature Coefficient: 100ppm/°C
• Noise - 0.1Hz to 10Hz: -
• Noise - 10Hz to 10kHz: 80µVrms
• Voltage - Input: -
• Current - Supply: -
• Current - Cathode: 73µA
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23-3

package: TO-236-3, SC-59, SOT-23-3

MIC2545A-1BTS

Microchip Technology

IC SW CURR LIMIT HI SIDE 14TSSOP

• Switch Type: USB Switch
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 2.7 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 3A
• Rds On (Typ): 35 mOhm
• Input Type: Non-Inverting
• Features: Slew Rate Controlled, Status Flag
• Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

package: 14-TSSOP (0.173", 4.40mm Width)

MIC2562A-1YTS-TR

Microchip Technology

IC PCMCIA/CARDBUS CTRLR 16-TSSOP

• Switch Type: PCMCIA Switch
• Number of Outputs: 2
• Ratio - Input:Output: 3:2
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: Logic
• Voltage - Load: 3.3V, 5V, 12V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 200mA
• Rds On (Typ): 70 mOhm
• Input Type: Non-Inverting
• Features: Status Flag
• Fault Protection: Current Limiting (Fixed), Over Temperature
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

MTD6508-ADJE/JQ

Microchip Technology

IC MOTOR DRIVER PAR 16UQFN

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushless DC (BLDC)
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (3)
• Interface: PWM
• Technology: Power MOSFET
• Step Resolution: -
• Applications: General Purpose
• Current - Output: 1A
• Voltage - Supply: 2 V ~ 5.5 V
• Voltage - Load: 2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-UQFN Exposed Pad
• Supplier Device Package: 16-UQFN (4x4)

package: 16-UQFN Exposed Pad

MCP6034T-E/SL

Microchip Technology

IC OPAMP GP 10KHZ RRO 14SOIC

• Amplifier Type: General Purpose
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 0.004 V/µs
• Gain Bandwidth Product: 10kHz
• -3db Bandwidth: -
• Current - Input Bias: 1pA
• Voltage - Input Offset: 150µV
• Current - Supply: 900nA
• Current - Output / Channel: 23mA
• Voltage - Supply, Single/Dual (±): 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

package: 14-SOIC (0.154", 3.90mm Width)

ATF16V8B-10JU

Microchip Technology

IC PLD 8MC 10NS 20PLCC

• Programmable Type: EE PLD
• Number of Macrocells: 8
• Voltage - Input: 5V
• Speed: 10ns
• Mounting Type: Surface Mount
• Package / Case: 20-LCC (J-Lead)
• Supplier Device Package: 20-PLCC (9x9)

package: 20-LCC (J-Lead)

PIC17C766T-33/L

Microchip Technology

IC MCU 8BIT 32KB OTP 84PLCC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 902 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

PIC18F13K50T-I/SS

Microchip Technology

IC MCU 8BIT 8KB FLASH 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 8KB (4K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: 20-SSOP (0.209", 5.30mm Width)

PIC10F322-I/MC

Microchip Technology

IC MCU 8BIT 896B FLASH 8DFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 3
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 3x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-VFDFN Exposed Pad
• Supplier Device Package: 8-DFN (2x3)

package: 8-VFDFN Exposed Pad

PIC16F723A-I/ML

Microchip Technology

IC MCU 8BIT 7KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 11x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

package: 28-VQFN Exposed Pad

PIC32MX764F128L-I/BG

Microchip Technology

IC MCU 32BIT 128KB FLASH 121BGA

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-TFBGA (10x10)

package: 121-TFBGA

ATMEGA329-16AU

Microchip Technology

IC MCU 8BIT 32KB FLASH 64TQFP

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: SPI, UART/USART, USI
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (14x14)

package: 64-TQFP

PIC16LF84-04I/P

Microchip Technology

IC MCU 8BIT 1.75KB FLASH 18DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 13
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 64 x 8
• RAM Size: 68 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 18-DIP (0.300", 7.62mm)
• Supplier Device Package: 18-PDIP

package: 18-DIP (0.300", 7.62mm)

PIC16LF1773-E/MX

Microchip Technology

IC MCU 8BIT 7KB FLASH 28UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 17x10b, D/A 3x5b, 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-UQFN Exposed Pad
• Supplier Device Package: 28-UQFN (6x6)

package: 28-UQFN Exposed Pad

MCP3422A6T-E/MC

Microchip Technology

IC ADC 18BIT 2CH 3.75SPS 8DFN

• Number of Bits: 18
• Sampling Rate (Per Second): 3.75
• Number of Inputs: 2
• Input Type: Differential
• Data Interface: I2C
• Configuration: MUX-PGA-ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: Sigma-Delta
• Reference Type: Internal
• Voltage - Supply, Analog: 2.7 V ~ 5.5 V
• Voltage - Supply, Digital: 2.7 V ~ 5.5 V
• Features: PGA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-VFDFN Exposed Pad
• Supplier Device Package: 8-DFN (2x3)
• Mounting Type: -

package: 8-VFDFN Exposed Pad

JAN1N4372C-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 3 V
• Tolerance: ±2%
• Power - Max: -
• Impedance (Max) (Zzt): 29 Ohms
• Current - Reverse Leakage @ Vr: 30 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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BZV55C6V2-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 6.2 V
• Tolerance: ±6%
• Power - Max: -
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 3 µA @ 4 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

package: -

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JANTX1N6313

Microchip Technology

DIODE ZENER 3.6V 500MW DO35

• Voltage - Zener (Nom) (Vz): 3.6 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 25 Ohms
• Current - Reverse Leakage @ Vr: 3 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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PIC24FJ256GL408T-I-PT

Microchip Technology

IC MCU 16BIT 256KB FLASH 80TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
• Peripherals: DMA, LCD, PWM, WDT
• Number of I/O: -
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
• Data Converters: A/D 24x10/12b; D/A 1x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP (12x12)

package: -

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CDLL4909-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): 12.8 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 50 Ohms
• Current - Reverse Leakage @ Vr: 15 µA @ 8 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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JANTX1N4117DUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 25 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 150 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 19 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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2N5314

Microchip Technology

POWER BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 20 A
• Voltage - Collector Emitter Breakdown (Max): 100 V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: 87.5 W
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: Stud Mount
• Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud
• Supplier Device Package: TO-61

package: -

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2N5879

Microchip Technology

PNP POWER TRANSISTOR SILICON AMP

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MV21003-150A-TR

Microchip Technology

GAAS TVAR NON HERMETIC EPSM SMT

• Capacitance @ Vr, F: 0.5pF @ 4V, 1MHz
• Capacitance Ratio: 3.4
• Capacitance Ratio Condition: C0/C30
• Voltage - Peak Reverse (Max): 30 V
• Diode Type: Single
• Q @ Vr, F: 7000 @ 4V, 50MHz
• Operating Temperature: -55°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

package: -

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2C6045

Microchip Technology

POWER BJT

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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