Microchip Technology Producten

DSC-TIMEFLASH-KIT2

Microchip Technology

TIMEFLASH OSCILLATOR PROGRAMMING

• Type: Number of Taps/Steps
• For Use With/Related Products: Function
• Contents: Delay to 1st Tap

package: -

DSC1033DI1-016.0000T

Microchip Technology

OSC MEMS 16.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 16MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 3mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

HCS200/P

Microchip Technology

IC CODE HOPP ENCODER 7FUNC 8-DIP

• Type: Code Hopping Encoder
• Applications: Remote Secure Access, Keyless Entry
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

LM2575-3.3BU TR

Microchip Technology

IC REG BUCK 3.3V 1A TO263-5

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Fixed
• Number of Outputs: 1
• Voltage - Input (Min): 4V
• Voltage - Input (Max): 40V
• Voltage - Output (Min/Fixed): 3.3V
• Voltage - Output (Max): -
• Current - Output: 1A
• Frequency - Switching: 52kHz
• Synchronous Rectifier: No
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-263-6, D2Pak (5 Leads + Tab), TO-263BA
• Supplier Device Package: TO-263-5

package: TO-263-6, D2Pak (5 Leads + Tab), TO-263BA

MCP6044-I/P

Microchip Technology

IC OPAMP GP 14KHZ RRO 14DIP

• Amplifier Type: General Purpose
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 0.003 V/µs
• Gain Bandwidth Product: 14kHz
• -3db Bandwidth: -
• Current - Input Bias: 1pA
• Voltage - Input Offset: 3mV
• Current - Supply: 600nA
• Current - Output / Channel: 20mA
• Voltage - Supply, Single/Dual (±): 1.4 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-PDIP

package: 14-DIP (0.300", 7.62mm)

KSZ8041TLA3

Microchip Technology

IC TXRX ETHERNET 48TQFP

• Type: Transceiver
• Protocol: MII, RMII
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

package: 48-TQFP

PIC18F66K90T-I/MRRSL

Microchip Technology

IC MCU 8BIT 64KB FLASH 64QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

package: 64-VFQFN Exposed Pad

PIC16C57T-HSE/SO

Microchip Technology

IC MCU 8BIT 3KB OTP 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 20
• Program Memory Size: 3KB (2K x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 72 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

PIC24FJ48GA004-E/ML

Microchip Technology

IC MCU 16BIT 48KB FLASH 44QFN

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 48KB (16K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

package: 44-VQFN Exposed Pad

PIC24F16KM202-E/SO

Microchip Technology

IC MCU 16BIT 16KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 16KB (5.5K x 24)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 19x10b/12b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

PIC16LF721-I/P

Microchip Technology

IC MCU 8BIT 7KB FLASH 20DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 12x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-PDIP

package: 20-DIP (0.300", 7.62mm)

PIC16LF18876-E/P

Microchip Technology

IC MCU 8BIT 28KB FLASH 40DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 28KB (16K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 35x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIP

package: 40-DIP (0.600", 15.24mm)

PIC18F25J50-I/SP

Microchip Technology

IC MCU 8BIT 32KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3.8K x 8
• Voltage - Supply (Vcc/Vdd): 2.15 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

AT28C256E-25DM/883

Microchip Technology

IC EEPROM 256K PARALLEL 28CDIP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 256Kb (32K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 250ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C (TC)
• Mounting Type: Through Hole
• Package / Case: 28-CDIP (0.600", 15.24mm)
• Supplier Device Package: 28-CDIP

package: 28-CDIP (0.600", 15.24mm)

PIC18F24Q10-I/STX

Microchip Technology

16KB FLASH, 1KB RAM, 256B EEPROM

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 24x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VFQFN Exposed Pad
• Supplier Device Package: 28-VQFN (4x4)

package: 28-VFQFN Exposed Pad

2C3420-MSCL

Microchip Technology

POWER BJT

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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JANS1N6354DUS

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 180 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1500 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 137 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

package: -

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JANS1N4481US

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 47 V
• Tolerance: ±5%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 50 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 37.6 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: A, SQ-MELF

package: -

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JANTX1N4995DUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 360 V
• Tolerance: ±1%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 1400 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 274 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: E-MELF

package: -

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JANTXV1N4115D-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 22 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 150 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 16.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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CD4148SBW

Microchip Technology

DIODE GEN PURP 75V 200MA DIE

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 75 V
• Current - Average Rectified (Io): 200mA
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 5 ns
• Current - Reverse Leakage @ Vr: 500 nA @ 75 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die
• Operating Temperature - Junction: -55°C ~ 175°C

package: -

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JANTXV1N4970-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 33 V
• Tolerance: ±5%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 25.1 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: E, Axial
• Supplier Device Package: E, Axial

package: -

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JANS1N4582AUR-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 6.4 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 25 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C (TA)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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1N5230B-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 4.7 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 19 Ohms
• Current - Reverse Leakage @ Vr: 50 µA @ 2 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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1N746A-1E3

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 3.3 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 24 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

JANS1N4493

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 150 V
• Tolerance: ±5%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 700 Ohms
• Current - Reverse Leakage @ Vr: 250 nA @ 120 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO-41, Axial
• Supplier Device Package: DO-41

package: -

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JANTX1N4108C-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 14 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 10.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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UES805HR2

Microchip Technology

DIODE GEN PURP 300V 50A DO5

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 300 V
• Current - Average Rectified (Io): 50A
• Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 50 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 50 ns
• Current - Reverse Leakage @ Vr: 70 µA @ 300 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5 (DO-203AB)
• Operating Temperature - Junction: -55°C ~ 150°C

package: -

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