Microchip Technology Producten

DSC1001CE2-040.0000

Microchip Technology

OSC MEMS 40.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 40MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

DSC1033CI1-030.0000T

Microchip Technology

OSC MEMS 30.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 30MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 3mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

MIC5216BMM

Microchip Technology

IC REG LIN POS ADJ 500MA 8MSOP

• Output Configuration: Positive
• Output Type: Adjustable
• Number of Regulators: 1
• Voltage - Input (Max): 12V
• Voltage - Output (Min/Fixed): Adjustable
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.6V @ 500mA
• Current - Output: 500mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 3µA ~ 8µA
• PSRR: 75dB (120Hz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Reverse Polarity
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MIC5320-SGYMT-TR

Microchip Technology

IC REG LINEAR 1.8V/3.3V 6TMLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.8V, 3.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.1V @ 150mA, 0.1V @ 150mA
• Current - Output: 150mA, 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 120µA ~ 190µA
• PSRR: 65dB ~ 45dB (1kHz ~ 20kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-UFDFN Exposed Pad, 6-TMLF?
• Supplier Device Package: 6-TMLF? (1.6x1.6)

package: 6-UFDFN Exposed Pad, 6-TMLF?

MIC2800-A4SYML-TR

Microchip Technology

IC REG TRPL BUCK/LINEAR 16MLF

• Topology: Step-Down (Buck) (1), Linear (LDO) (2)
• Function: Any Function
• Number of Outputs: 3
• Frequency - Switching: 2MHz
• Voltage/Current - Output 1: Adj, 600mA
• Voltage/Current - Output 2: 1.2V, 300mA
• Voltage/Current - Output 3: 3.3V, 300mA
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: No
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN, 16-MLF?
• Supplier Device Package: 16-MLF? (4x4)

package: 16-VFQFN, 16-MLF?

MIC2544-1BMM

Microchip Technology

IC SW CURR LIMIT HI SIDE 8-MSOP

• Switch Type: USB Switch
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 2.7 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 1.5A
• Rds On (Typ): 80 mOhm
• Input Type: Non-Inverting
• Features: Status Flag
• Fault Protection: Current Limiting (Adjustable), Over Temperature
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MIC2584-JYTS

Microchip Technology

IC CTRLR HOT SWAP DUAL 16-TSSOP

• Type: Hot Swap Controller
• Number of Channels: 2
• Internal Switch(s): No
• Applications: General Purpose
• Features: Latched Fault
• Programmable Features: Fault Timeout, Slew Rate, UVLO
• Voltage - Supply: 1 V ~ 13.2 V
• Current - Output (Max): -
• Operating Temperature: -40°C ~ 85°C
• Current - Supply: 1.7mA
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

AT27C080-15RC

Microchip Technology

IC OTP 8MBIT 150NS 32SOIC

• Memory Type: Non-Volatile
• Memory Format: EPROM
• Technology: EPROM - OTP
• Memory Size: 8Mb (1M x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: -
• Access Time: 150ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-SOIC (0.445", 11.30mm Width)
• Supplier Device Package: 32-SOIC

package: 32-SOIC (0.445", 11.30mm Width)

AT28C256-20FM/883-815

Microchip Technology

IC EEPROM 256KBIT 200NS 28FLATPK

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 256Kb (32K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 200ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C (TC)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

SY89845UMG-TR

Microchip Technology

IC MUX CML RPE 2:1 PREC 24-MLF

• Type: Multiplexer
• Circuit: 1 x 2:1
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2.375 V ~ 2.625 V, 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad, 24-MLF?
• Supplier Device Package: 24-MLF? (4x4)

package: 24-VFQFN Exposed Pad, 24-MLF?

SY58051UMG-TR

Microchip Technology

IC GATE CML UNIV I/O TERM 16-MLF

• Logic Type: Configurable Multiple Function
• Number of Circuits: 1
• Number of Inputs: 2
• Schmitt Trigger Input: No
• Output Type: Differential
• Current - Output High, Low: -
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad, 16-MLF?
• Supplier Device Package: 16-MLF? (3x3)

package: 16-VFQFN Exposed Pad, 16-MLF?

DSPIC33EP256GM710T-I/PF

Microchip Technology

IC MCU 16BIT 256KB FLASH 100TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 70 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 256KB (85.5K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: A/D 49x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

package: 100-TQFP

ATMEGA162L-8MC

Microchip Technology

IC MCU 8BIT 16KB FLASH 44VQFN

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: -
• Package / Case: 44-VFQFN Exposed Pad
• Supplier Device Package: 44-VQFN (7x7)

package: 44-VFQFN Exposed Pad

PIC16C770T-I/SO

Microchip Technology

IC MCU 8BIT 3.5KB OTP 20SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 15
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

ATSAMD21E16L-AF

Microchip Technology

IC MCU 32BIT 64KB FLASH 32TQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 10x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-TQFP
• Supplier Device Package: 32-TQFP (7x7)

package: 32-TQFP

PIC16LF1782-E/SP

Microchip Technology

IC MCU 8BIT 3.5KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PSMC, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

PIC16F687-E/SS

Microchip Technology

IC MCU 8BIT 3.5KB FLASH 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 18
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: 20-SSOP (0.209", 5.30mm Width)

PIC16F18323T-I/SL

Microchip Technology

IC MCU 8BIT 3.5KB FLASH 14SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 11x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

package: 14-SOIC (0.154", 3.90mm Width)

PIC16LF18444-E/P

Microchip Technology

COMPARATOR, DAC, 12-BIT ADCC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 17x12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-PDIP

package: 20-DIP (0.300", 7.62mm)

PIC18F45K42T-I/MVVAO

Microchip Technology

32KB FLASH 2KB RAM 256B EEPROM 1

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
• Data Converters: A/D 35x12b; D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 40-UFQFN Exposed Pad
• Supplier Device Package: 40-UQFN (5x5)

package: 40-UFQFN Exposed Pad

CD4689V

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 5.1 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 10 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

package: -

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1N6334

Microchip Technology

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 27 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 27 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 21 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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UFS180GE3-TR13

Microchip Technology

DIODE GEN PURP 800V 1A SMBG

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 800 V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 1 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 60 ns
• Current - Reverse Leakage @ Vr: 20 µA @ 600 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: DO-215AA, SMB Gull Wing
• Supplier Device Package: SMBG (DO-215AA)
• Operating Temperature - Junction: -55°C ~ 175°C

package: -

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JANSR2N2920L

Microchip Technology

RH SMALL-SIGNAL BJT

• Transistor Type: 2 NPN (Dual)
• Current - Collector (Ic) (Max): 30mA
• Voltage - Collector Emitter Breakdown (Max): 60V
• Vce Saturation (Max) @ Ib, Ic: 300mV @ 100µA, 1mA
• Current - Collector Cutoff (Max): 10µA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
• Power - Max: 350mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-78-6 Metal Can
• Supplier Device Package: TO-78-6

package: -

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MSCSM70HM038CAG

Microchip Technology

SIC MOSFET

• FET Type: -
• FET Feature: -
• Drain to Source Voltage (Vdss): -
• Current - Continuous Drain (Id) @ 25°C: -
• Rds On (Max) @ Id, Vgs: -
• Vgs(th) (Max) @ Id: -
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: -
• Power - Max: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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1N5281BE3-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 200 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 2500 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 152 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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JANTX1N4454-1

Microchip Technology

DIODE GEN PURP 50V 200MA DO35

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 50 V
• Current - Average Rectified (Io): 200mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 4 ns
• Current - Reverse Leakage @ Vr: 100 nA @ 50 V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)
• Operating Temperature - Junction: -65°C ~ 175°C

package: -

GMV2114-GM1

Microchip Technology

SI TVAR NON HERMETIC PLASTIC SMT

• Capacitance @ Vr, F: 0.5pF @ 20V, 1MHz
• Capacitance Ratio: 3.3
• Capacitance Ratio Condition: C4/C20
• Voltage - Peak Reverse (Max): 22 V
• Diode Type: Single
• Q @ Vr, F: 900 @ 4V, 50MHz
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805

package: -

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