Microchip Technology Producten

DSC1001BI2-114.2850T

Microchip Technology

OSC MEMS 114.2850MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 114.285MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 8.7mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

MIC2544-2YM-TR

Microchip Technology

IC SW CURR LIMIT HI SIDE 8-SOP

• Switch Type: USB Switch
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 2.7 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 1.5A
• Rds On (Typ): 80 mOhm
• Input Type: Non-Inverting
• Features: Status Flag
• Fault Protection: Current Limiting (Adjustable), Over Temperature
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

AT28C256E-15SC

Microchip Technology

IC EEPROM 256KBIT 150NS 28SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 256Kb (32K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 150ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

AT25128-10PC-1.8

Microchip Technology

IC EEPROM 128KBIT 2.1MHZ 8DIP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 128Kb (16K x 8)
• Memory Interface: SPI
• Clock Frequency: 2.1MHz
• Write Cycle Time - Word, Page: 10ms
• Access Time: -
• Voltage - Supply: 1.8 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

11LC010T-I/MS

Microchip Technology

IC EEPROM 1KBIT 100KHZ 8MSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (128 x 8)
• Memory Interface: Single Wire
• Clock Frequency: 100kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

SY100EL16VAZC TR

Microchip Technology

IC RCVR DIFF 5V/3.3V 8-SOIC

• Logic Type: Differential Receiver
• Supply Voltage: 3.3V, 5V
• Number of Bits: 1
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

SY89546UMI

Microchip Technology

IC MUX 4:1 LVDS DIFF 2.5V 32MLF

• Type: Multiplexer
• Circuit: 1 x 4:1
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad, 32-MLF?
• Supplier Device Package: 32-MLF? (5x5)

package: 32-VFQFN Exposed Pad, 32-MLF?

ATA6620-TASY

Microchip Technology

IC TXRX LIN BUS 5V/50MA 8SOIC

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 30mV
• Data Rate: -
• Voltage - Supply: 5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

TS87C51RB2-LCE

Microchip Technology

IC MCU 8BIT 16KB OTP 44VQFP

• Core Processor: 80C51
• Core Size: 8-Bit
• Speed: 30/20MHz
• Connectivity: UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: -

package: 44-QFP

PIC16C76-20E/SO

Microchip Technology

IC MCU 8BIT 14KB OTP 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 368 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

ATUC128D3-Z2UR

Microchip Technology

IC MCU 32BIT 128KB FLASH 64QFN

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

package: 64-VFQFN Exposed Pad

ATSAME70Q19A-CFNT

Microchip Technology

IC MCU 32BIT 512KB FLASH 144FBGA

• Core Processor: ARM? Cortex?-M7
• Core Size: 32-Bit
• Speed: 300MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 114
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 24x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-UFBGA
• Supplier Device Package: 144-UFBGA (6x6)

package: 144-UFBGA

ATSAM4S4BA-AU

Microchip Technology

IC MCU 32BIT 256KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 47
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 11x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

PIC24FJ128GA106-I/MR

Microchip Technology

IC MCU 16BIT 128KB FLASH 64QFN

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

package: 64-VFQFN Exposed Pad

MCP37220T-200I/TL

Microchip Technology

IC ADC 14BIT 200MSPS 124VTLA

• Number of Bits: 14
• Sampling Rate (Per Second): 200M
• Number of Inputs: 1
• Input Type: Differential
• Data Interface: LVDS - Parallel, Parallel
• Configuration: S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: Pipelined
• Reference Type: Internal
• Voltage - Supply, Analog: 1.2V, 1.8V
• Voltage - Supply, Digital: 1.2V, 1.8V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 124-VFTLA Dual Row Exposed Pad
• Supplier Device Package: 124-VTLA (9x9)
• Mounting Type: -

package: 124-VFTLA Dual Row Exposed Pad

MRF24WG0MB-I/RM

Microchip Technology

RF TXRX MODULE WIFI U.FL ANT

• RF Family/Standard: WiFi
• Protocol: 802.11b/g
• Modulation: DSSS, OFDM
• Frequency: 2.4GHz
• Data Rate: 54Mbps
• Power - Output: 18dBm
• Sensitivity: -95dBm
• Serial Interfaces: SPI
• Antenna Type: Not Included, U.FL
• Memory Size: -
• Voltage - Supply: 2.8 V ~ 3.6 V
• Current - Receiving: 156mA
• Current - Transmitting: 226mA ~ 237mA
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 36-SMD Module

package: 36-SMD Module

VSC8479YHQ-02

Microchip Technology

FAST LOCK 16 BIT SFI4.1 10G SERD

• Function: Transceiver
• Interface: I²C, SPI
• Number of Circuits: 1
• Voltage - Supply: 1.8V
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -5°C ~ 90°C
• Mounting Type: Surface Mount
• Package / Case: 195-BGA, FCBGA
• Supplier Device Package: 195-FCBGA (12x12)

package: 195-BGA, FCBGA

PIC16LF18444T-I/SS

Microchip Technology

COMPARATOR, DAC, 12-BIT ADCC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 17x12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: 20-SSOP (0.209", 5.30mm Width)

PM8303A-WGI

Microchip Technology

SMALL FORM FACTOR SATA/SAS ACTIV

• Type: -
• Circuit: -
• Independent Circuits: -
• Current - Output High, Low: -
• Voltage Supply Source: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

ZL88702LDF1

Microchip Technology

IC TRACKING BATT 150V 2CH 64QFN

• Function: Telecom Circuit
• Interface: PCM
• Number of Circuits: 1
• Voltage - Supply: 3.135V ~ 3.465V
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

package: 64-VFQFN Exposed Pad

JANTXV1N6311CUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 3 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 29 Ohms
• Current - Reverse Leakage @ Vr: 30 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

package: -

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JANS1N6320US-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 6.8 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 3 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 4 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

package: -

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1N5222A

Microchip Technology

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 2.5 V
• Tolerance: ±10%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 30 Ohms
• Current - Reverse Leakage @ Vr: 100 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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CD5341B

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 6.2 V
• Tolerance: ±5%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 1 Ohms
• Current - Reverse Leakage @ Vr: 1 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 200°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

package: -

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1N4776-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): 8.5 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: 0°C ~ 75°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-35

package: -

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JANTX1N6350US

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 113 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 600 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 91 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

package: -

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PIC32CX2051MTG128T-I-X9B

Microchip Technology

SINGLE CORE, 2MB FLASH, 512KB SR

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: Flexcomm, I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 102
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 128-TQFP Exposed Pad
• Supplier Device Package: 128-TQFP-EP (14x14)

package: -

CDLL5254C-TR

Microchip Technology

DIODE ZENER 27V DO-213AA

• Voltage - Zener (Nom) (Vz): 27 V
• Tolerance: ±2%
• Power - Max: -
• Impedance (Max) (Zzt): 41 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 21 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

package: -

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