Microchip Technology Producten

DSC1030BI1-025.0000

Microchip Technology

OSC MEMS 25.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 25MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 3mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

DSC1121CI5-014.7456T

Microchip Technology

OSC MEMS 14.7456MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 14.7456MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 35mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead

DSC1001DE2-016.0000T

Microchip Technology

OSC MEMS 16.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 16MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

DSC1121CI2-132.0000

Microchip Technology

OSC MEMS 132.000MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 132MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 35mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead

DSC1001DI1-010.0000T

Microchip Technology

OSC MEMS 10.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 10MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

MCP1319MT-33AE/OT

Microchip Technology

IC SUPERVISOR 3.3V SOT23-5

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Open Drain, Push-Pull
• Reset: Active High/Active Low
• Reset Timeout: 1 ms Minimum
• Voltage - Threshold: 3.3V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

package: SC-74A, SOT-753

AT25DF081A-SH-T

Microchip Technology

IC FLASH 8MBIT 100MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 8Mb (256 Bytes x 4096 pages)
• Memory Interface: SPI
• Clock Frequency: 100MHz
• Write Cycle Time - Word, Page: 7µs, 3ms
• Access Time: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.209", 5.30mm Width)

AT28C010-12FM/883-341

Microchip Technology

IC EEPROM 1MBIT 120NS 32FLATPACK

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Mb (128K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 120ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C (TC)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

LAN9252TV/ML

Microchip Technology

IC ETHERCAT CTLR 10/100 64QFN

• Protocol: Ethernet
• Function: Controller
• Interface: SPI
• Standards: 10/100 Base-FX/T/TX PHY
• Voltage - Supply: 1.8 V ~ 3.3 V
• Current - Supply: -
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

package: 64-VFQFN Exposed Pad

ATF22V10CZ-15SC

Microchip Technology

IC PLD 10MC 15NS 24SOIC

• Programmable Type: EE PLD
• Number of Macrocells: 10
• Voltage - Input: 5V
• Speed: 15ns
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SOIC

package: 24-SOIC (0.295", 7.50mm Width)

AT89C51SND2C-7FTUL

Microchip Technology

IC MCU 8BIT 64KB FLASH 100CTBGA

• Core Processor: 80C51
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, IDE/ATAPI, Memory Card, SPI, UART/USART, USB
• Peripherals: Audio, I2S, MP3, PCM, POR, WDT
• Number of I/O: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2.25K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-CTBGA (9x9)

package: 100-TFBGA

ATSAMS70Q20A-ANT

Microchip Technology

IC MCU 32BIT 1MB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M7
• Core Size: 32-Bit
• Speed: 300MHz
• Connectivity: EBI/EMI, I2C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 114
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
• Data Converters: A/D 24x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

PIC18F2585-E/SO

Microchip Technology

IC MCU 8BIT 48KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 3.25K x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

DSPIC33FJ64GP706A-E/MR

Microchip Technology

IC MCU 16BIT 64KB FLASH 64QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

package: 64-VFQFN Exposed Pad

DSPIC33EP512GP506T-I/PT

Microchip Technology

IC MCU 16BIT 512KB FLASH 64TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 70 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 512KB (170K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 24K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

package: 64-TQFP

SY58012UMI-TR

Microchip Technology

IC CLK BUFFER 1:2 5GHZ 16MLF

• Type: Fanout Buffer (Distribution), Translator
• Number of Circuits: 1
• Ratio - Input:Output: 1:2
• Differential - Input:Output: Yes/Yes
• Input: CML, LVDS, LVPECL
• Output: LVPECL
• Frequency - Max: 5GHz
• Voltage - Supply: 2.375 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad, 16-MLF?
• Supplier Device Package: 16-MLF? (3x3)

package: 16-VFQFN Exposed Pad, 16-MLF?

MCP3004T-I/SLVAO

Microchip Technology

IC ADC 10BIT 2.7V 4CH SPI 14SOIC

• Number of Bits: 10
• Sampling Rate (Per Second): 200k
• Number of Inputs: 2, 4
• Input Type: Pseudo-Differential, Single Ended
• Data Interface: SPI
• Configuration: MUX-S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: SAR
• Reference Type: External
• Voltage - Supply, Analog: 2.7 V ~ 5.5 V
• Voltage - Supply, Digital: 2.7 V ~ 5.5 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC
• Mounting Type: -

package: 14-SOIC (0.154", 3.90mm Width)

PIC16LF19156-E/SS

Microchip Technology

28KB FLASH, 2KB RAM, 256KB EE, L

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 28KB (16K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 20x12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

package: 28-SSOP (0.209", 5.30mm Width)

SST26VF064BEUI-104I/MF

Microchip Technology

64MB 2.3V TO 3.6V SQI FLASH MEMO

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 64Mb (8M x 8)
• Memory Interface: SPI - Quad I/O
• Clock Frequency: 104MHz
• Write Cycle Time - Word, Page: 1.5ms
• Access Time: -
• Voltage - Supply: 2.7V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-WDFN Exposed Pad
• Supplier Device Package: 8-WDFN (5x6)

package: 8-WDFN Exposed Pad

LE87536NQC

Microchip Technology

2CH ADSL2+ LINE DRIVER 12V QFN16

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

MCP47CMD12T-E-MF

Microchip Technology

IC DAC 10BIT V-OUT 10DFN

• Number of Bits: 10
• Number of D/A Converters: 2
• Settling Time: 4µs
• Output Type: Voltage - Buffered
• Differential Output: No
• Data Interface: I2C
• Reference Type: External, Internal, Supply
• Voltage - Supply, Analog: 1.8V ~ 5.5V
• Voltage - Supply, Digital: 1.8V ~ 5.5V
• INL/DNL (LSB): ±0.25 (Max), ±0.25 (Max)
• Architecture: String DAC
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-DFN (3x3)
• Mounting Type: Surface Mount

package: -

DSC400-1111Q0132KE1T

Microchip Technology

IC CLOCK GENERATOR 20QFN

• Type: Clock Generator
• PLL: Yes
• Input: Clock
• Output: HCSL, LVCMOS, LVDS, LVPECL
• Number of Circuits: 2
• Ratio - Input:Output: 2:4
• Differential - Input:Output: No/Yes
• Frequency - Max: 176.875MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 2.25V ~ 3.6V
• Operating Temperature: -20°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (5x3.2)

package: -

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JANHCA1N757A

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 9.1 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 1 µA @ 7 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-35

package: -

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MSC100SM70JCU2

Microchip Technology

SICFET N-CH 700V 124A SOT227

• FET Type: N-Channel
• Technology: SiCFET (Silicon Carbide)
• Drain to Source Voltage (Vdss): 700 V
• Current - Continuous Drain (Id) @ 25°C: 124A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 20V
• Vgs(th) (Max) @ Id: 2.4V @ 4mA
• Gate Charge (Qg) (Max) @ Vgs: 215 nC @ 20 V
• Input Capacitance (Ciss) (Max) @ Vds: 4500 pF @ 700 V
• Vgs (Max): +25V, -10V
• FET Feature: -
• Power Dissipation (Max): 365W (Tc)
• Rds On (Max) @ Id, Vgs: 19mOhm @ 40A, 20V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Chassis Mount
• Supplier Device Package: SOT-227 (ISOTOP®)
• Package / Case: SOT-227-4, miniBLOC

package: -

JANTX1N3328RB

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 43 V
• Tolerance: ±5%
• Power - Max: 50 W
• Impedance (Max) (Zzt): 4.5 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 32.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5

package: -

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2N5678

Microchip Technology

POWER BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 10 A
• Voltage - Collector Emitter Breakdown (Max): 100 V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: 175 W
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: Stud Mount
• Package / Case: TO-211MB, TO-63-4, Stud
• Supplier Device Package: TO-63

package: -

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JANS1N4616UR-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 2.2 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1300 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TA)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

package: -

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JANS1N4963US-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: -
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote