Afbeelding |
Onderdeelnummer |
Fabrikant |
Omschrijving |
package |
Voorraad |
Aantal |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
ARROW 2XGE PB FREE
|
package: 896-BGA |
Voorraad6.240 |
|
GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
||
Microchip Technology |
ARROW 2XGE PB FREE
|
package: 896-BGA |
Voorraad5.952 |
|
GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
||
Microchip Technology |
TEMUX-84 WITH E3 MAPPERS, DS3/E3
|
package: 324-FBGA |
Voorraad3.280 |
|
E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
||
Microchip Technology |
TEMUX-84 WITH E3 MAPPERS, DS3/E3
|
package: 324-FBGA |
Voorraad2.576 |
|
E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC CESOP PROC 1024CH 552BGA
|
package: 552-BGA |
Voorraad5.184 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
TEMAP 84FDL, LF BUMP
|
package: - |
Voorraad2.816 |
|
E1, T1 | - | - | - | - | - | - | - | - |
||
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8
|
package: - |
Voorraad4.144 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
ARROW 8XFE PB FREE
|
package: - |
Voorraad3.920 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
8 CHANNEL FAST ETHERNET OVER SON
|
package: - |
Voorraad3.104 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
ARROW M8XFE
|
package: - |
Voorraad6.576 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 552BGA
|
package: 552-BGA |
Voorraad3.504 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
8 CHANNEL 10/100 OR 1XGE ETHERNE
|
package: - |
Voorraad5.968 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
TEMAP 84FDL GREEN DUAL PASSIVATI
|
package: - |
Voorraad3.696 |
|
E1, T1 | - | - | - | - | - | - | - | - |
||
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8
|
package: - |
Voorraad5.184 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SINGLE-CHIP SONET/SDH TRANSPORT
|
package: - |
Voorraad4.944 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
TELECOM INTERFACE ICS 32 LINK
|
package: - |
Voorraad3.152 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROC 256CH 552BGA
|
package: 552-BGA |
Voorraad5.520 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
IC DGTL SWITCH F16KDX 272BGA
|
package: 272-BGA |
Voorraad4.416 |
|
- | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
||
Microchip Technology |
32 CHANNEL T1/E1 FRAMER
|
package: - |
Voorraad6.816 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
32 LINK, 256 HDLC CHANNEL FRAME
|
package: - |
Voorraad3.904 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 324BGA
|
package: 324-BGA |
Voorraad5.760 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI
|
package: - |
Voorraad5.040 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI
|
package: - |
Voorraad6.224 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 552BGA
|
package: 552-BGA |
Voorraad5.296 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA
|
package: 324-BGA |
Voorraad2.192 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 208LBGA
|
package: 208-LBGA |
Voorraad2.272 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA
|
package: 324-BGA |
Voorraad5.200 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC DIGITAL SWITCH 16K CH 256LQFP
|
package: 256-LQFP |
Voorraad7.536 |
|
- | 1 | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |