Afbeelding |
Onderdeelnummer |
Fabrikant |
Omschrijving |
package |
Voorraad |
Aantal |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Maxim Integrated |
IC TXRX QUAD T1/E1 BGA
|
package: 256-BGA |
Voorraad2.496 |
|
E1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
|
|
|
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
package: - |
Voorraad7.776 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
|
|
Exar Corporation |
IC LIU E3/DS3/STS-1 4CH 144LQFP
|
package: 144-LQFP |
Voorraad5.888 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-LQFP (20x20) |
|
|
Cirrus Logic Inc. |
IC LINE INTERFACE T1/E1 64LQFP
|
package: 64-LQFP |
Voorraad7.760 |
|
E1, T1 | 2 | 3.135 ~ 5.25 V | - | 350mW | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP |
|
|
|
IDT, Integrated Device Technology Inc |
IC FRAMER T1/J1/E1 8CH 144-BGA
|
package: 144-BGA |
Voorraad2.688 |
|
Parallel | 8 | 2.97 V ~ 3.63 V | 160mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA | 144-PBGA (13x13) |
|
|
Cypress Semiconductor Corp |
IC TXRX HOTLINK II DUAL 196LBGA
|
package: 196-LBGA |
Voorraad2.064 |
|
LVTTL | 2 | 3.135 V ~ 3.465 V | 570mA | - | -40°C ~ 85°C | Surface Mount | 196-LBGA | 196-FBGA (15x15) |
|
|
|
NXP |
IC ATM CELL PROCESSOR 256BGA
|
package: 256-BBGA |
Voorraad7.040 |
|
JTAG, PHY, UTOPIA | 1 | 3 V ~ 3.6 V | 300mA | - | -40°C ~ 85°C | Surface Mount | 256-BBGA | 256-PBGA |
|
|
Texas Instruments |
IC PROCESSOR OCTL DIF PCM 28PLCC
|
package: 28-LCC (J-Lead) |
Voorraad2.304 |
|
ADPCM | 8 | 5V | 10mA | 50mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
|
|
|
Microsemi Corporation |
IC TDM SWITCH 512CH FLEX 144LBGA
|
package: 144-LBGA |
Voorraad7.488 |
|
- | 1 | 3 V ~ 3.6 V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
|
|
|
IDT, Integrated Device Technology Inc |
IC LIU T1/E1/J1 2CH 81BGA
|
package: 81-LFBGA |
Voorraad5.968 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 81-LFBGA | 81-CABGA (8x8) |
|
|
Microsemi Corporation |
IC TDM/TSI ST-BUS 32CH 28DIP
|
package: 28-DIP (0.600", 15.24mm) |
Voorraad9.504 |
|
Parallel | 1 | 4.75 V ~ 5.25 V | 10µA | - | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
|
|
|
Microsemi Corporation |
IC CODEC U-LAW PCM 20DIP
|
package: 20-DIP (0.300", 7.62mm) |
Voorraad27.780 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 3mA | - | 0°C ~ 70°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
|
|
|
Silicon Labs |
IC PROSLIC FXS DC-DC -135V 42QFN
|
package: 42-WFQFN Exposed Pad |
Voorraad3.648 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
|
|
|
Microsemi Solutions Sdn Bhd. |
24 PORT MANAGED LAYER 2-SWITCH
|
package: - |
Voorraad3.936 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
|
|
|
Microsemi Solutions Sdn Bhd. |
QUAD GIGABIT 10/100/1000 BT & 10
|
package: - |
Voorraad6.928 |
|
- | 1 | 1V | - | - | - | Surface Mount | - | 256-BGA (17x17) |
|
|
|
Microsemi Corporation |
WSE-40, LF BUMP
|
package: 672-BGA, FCBGA |
Voorraad5.536 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | 672-BGA, FCBGA | 672-FCBGA (27x27) |
|
|
|
Microsemi Corporation |
SINGLE-CHIP SONET/SDH TRANSPORT
|
package: - |
Voorraad2.784 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
SINGLE PORT 10G XAUI/RXAUI WITH
|
package: 196-BGA |
Voorraad3.648 |
|
SPI | 2 | 1V, 1.2V | - | - | -40°C ~ 110°C | Surface Mount | 196-BGA | 196-FCBGA (15x15) |
|
|
|
Microchip Technology |
IC RECEIVER DTMF 50DB 18SOIC
|
package: 18-SOIC (0.295", 7.50mm Width) |
Voorraad3.904 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
|
|
Microchip Technology |
IC TXRX DTMF 20DIP
|
package: 20-DIP (0.300", 7.62mm) |
Voorraad6.544 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
|
|
|
Microchip Technology |
IC VOICEPORT 1CH FXS 4KHZ 44LQFP
|
package: 44-LQFP |
Voorraad2.416 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
|
|
|
Infineon Technologies |
BIPOLAR SLIC, 2-4 CONVERSION
|
package: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Intersil |
ITU LOW COST, PABX SLIC WITH 40M
|
package: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
160G ENTERPRISE ETHERNET SWITCH
|
package: - |
Voorraad60 |
|
Ethernet | 57 | - | - | - | - | Surface Mount | 888-BGA, FCBGA | 888-FCBGA (25x25) |
|
|
|
Broadcom Limited |
SWITCH FABRIC
|
package: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Gennum |
GENNUM TELECOM CIRCUIT 1-FUNC
|
package: - |
Request a Quote |
|
- | - | 3.3V | 480mA | - | 0°C ~ 70°C | Surface Mount | 128-QFP | 128-QFP |
|
|
|
Broadcom Limited |
EPON/GPON 2XGE, 2XFE
|
package: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Harris Corporation |
EIA/ITU PABX SLIC WITH 30MA LOOP
|
package: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
