Ingesloten - Systeem op chip (SoC)

10AS032H1F34E1SG

Altera

IC SOC FPGA 384 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 320K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

5ASXMB5G4F40C6N

Altera

IC FPGA 528 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 700MHz
• Primary Attributes: FPGA - 462K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

5ASXFB5H6F40C6N

Altera

IC FPGA 528 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 700MHz
• Primary Attributes: FPGA - 462K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

10AS016C4U19I3SG

Altera

IC SOC FPGA 192 I/O 484UBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 160K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BFBGA, FCBGA
• Supplier Device Package: 484-UBGA (19x19)

package: 484-BFBGA, FCBGA

XCZU15EG-2FFVC900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XC7Z045-2FBG676E

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XCZU4CG-2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

package: 784-BBGA, FCBGA

M2S025T-VF400I

Microsemi Corporation

IC FPGA SOC 25K LUTS 400VFBGA

• Architecture: MCU, FPGA
• Core Processor: ARM? Cortex?-M3
• Flash Size: 256KB
• RAM Size: 64KB
• Peripherals: DDR, PCIe, SERDES
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
• Speed: 166MHz
• Primary Attributes: FPGA - 25K Logic Modules
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-VFBGA (17x17)

package: 400-LFBGA

A2F200M3F-1FGG484I

Microsemi Corporation

IC FPGA 200K GATES 256KB 256-BGA

• Architecture: MCU, FPGA
• Core Processor: ARM? Cortex?-M3
• Flash Size: 256KB
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
• Speed: 100MHz
• Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FPBGA (23x23)

package: 484-BGA

10AS057K1F40I1HG

Intel

IC SOC FPGA 696 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 570K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

10AS027E3F29I2LG

Intel

780-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 270K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

10AS066H3F34E2SG

Intel

IC SOC FPGA 492 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 660K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

package: 1152-BBGA, FCBGA

AGFB008R24D2I2V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 764K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

package: -

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BCM11350KFEBG

Broadcom Limited

VOIP PART, 1.25GHZ, 3D, 17X17 FC

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MPFS250T-FCVG484E

Microchip Technology

IC SOC RISC-V 484FCBGA

• Architecture: MPU, FPGA
• Core Processor: RISC-V
• Flash Size: 128kB
• RAM Size: 2.2MB
• Peripherals: DMA, PCI, PWM
• Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Speed: -
• Primary Attributes: FPGA - 254K Logic Modules
• Operating Temperature: 0°C ~ 100°C
• Package / Case: 484-BFBGA, FCBGA
• Supplier Device Package: 484-FCBGA (19x19)

package: -

XCVC1902-2MSEVIVA1596

AMD

IC VERSAL AICORE FPGA 1596BGA

• Architecture: MPU, FPGA
• Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DDR, DMA, PCIe
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.4GHz
• Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1596-BFBGA, FCBGA
• Supplier Device Package: 1596-FCBGA (40x40)

package: -

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AGFB006R24C2I1V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 573K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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AGFB022R31C2E3VAA

Intel

IC FPGA AGILEX-F 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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AGFC019R25A2I2V

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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AGIB027R31B2E2VR0

Intel

IC FPGA AGILEX-I 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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1SX280HH2F55E2VG

Intel

IC FPGA STRATIX 10 2912FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA, FC (55x55)

package: -

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XCZU3EG-2UBVA530E

AMD

IC ZUP MPSOC A53 FPGA 530BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 600MHz, 1.333GHz
• Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 530-WFBGA, FCBGA
• Supplier Device Package: 530-FCBGA (16x9.5)

package: -

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1SX065HH3F35E2LG

Intel

IC FPGA STRATIX10SX 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 650K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: -

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MPFS160TL-FCSG536E

Microchip Technology

IC SOC RISC-V 536LFBGA

• Architecture: MPU, FPGA
• Core Processor: RISC-V
• Flash Size: 128kB
• RAM Size: 1.4125MB
• Peripherals: DMA, PCI, PWM
• Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Speed: -
• Primary Attributes: FPGA - 161K Logic Modules
• Operating Temperature: 0°C ~ 100°C
• Package / Case: 536-LFBGA, CSPBGA
• Supplier Device Package: 536-LFBGA

package: -

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XCZU49DR-2FFVF1760E

AMD

IC ZUP RFSOC A53 FPGA 1760BGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DDR, DMA, PCIe
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.333GHz
• Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: -

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1SX110HN1F43E2VG

Intel

IC FPGA STRATIX 10 1760FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 1100K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

package: -

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AGFD019R25A1I1V

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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BCM68650A1IFSBG

Broadcom Limited

IC SOC OLT PON MAC

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

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