Pagina 135 - Ingesloten - Systeem op chip (SoC) | Geïntegreerde schakelingen (IC's) | Heisener Electronics
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Ingesloten - Systeem op chip (SoC)

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Afbeelding
Onderdeelnummer
Fabrikant
Omschrijving
package
Voorraad
Aantal
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
A2F060M3E-CS288
Microsemi Corporation

IC FPGA 60K GATES 128KB 288-CSP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 288-TFBGA, CSPBGA
  • Supplier Device Package: 288-CSP (11x11)
package: 288-TFBGA, CSPBGA
Voorraad7.136
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
0°C ~ 85°C (TJ)
288-TFBGA, CSPBGA
288-CSP (11x11)
10AS066K3F40E2LG
Altera

IC SOC FPGA 696 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
package: 1517-BBGA, FCBGA
Voorraad4.944
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 660K Logic Elements
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
10AS016E4F27E3LG
Altera

IC SOC FPGA 240 I/O 672FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 160K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
package: 672-BBGA, FCBGA
Voorraad5.616
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 160K Logic Elements
0°C ~ 100°C (TJ)
672-BBGA, FCBGA
672-FBGA (27x27)
XCZU11EG-1FFVC1760E
Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
package: 1760-BBGA, FCBGA
Voorraad4.352
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 653K+ Logic Cells
0°C ~ 100°C (TJ)
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
XCZU15EG-1FFVC900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
package: 900-BBGA, FCBGA
Voorraad6.240
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 747K+ Logic Cells
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
M2S050T-1VF400
Microsemi Corporation

IC FPGA SOC 50K LUTS 400VFBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 50K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
package: 400-LFBGA
Voorraad5.040
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 50K Logic Modules
0°C ~ 85°C (TJ)
400-LFBGA
400-VFBGA (17x17)
XC7Z014S-1CLG400I
Xilinx Inc.

IC FPGA SOC 200I/O 400BGA

  • Architecture: MCU, FPGA
  • Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix?-7 FPGA, 65K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 400-LFBGA, CSPBGA
  • Supplier Device Package: 400-CSPBGA (17x17)
package: 400-LFBGA, CSPBGA
Voorraad6.608
Single ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Artix?-7 FPGA, 65K Logic Cells
-40°C ~ 100°C (TJ)
400-LFBGA, CSPBGA
400-CSPBGA (17x17)
A2F500M3G-FGG484I
Microsemi Corporation

IC FPGA 500K GATES 512KB 484-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
package: 484-BGA
Voorraad7.056
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-40°C ~ 100°C (TJ)
484-BGA
484-FPBGA (23x23)
10AS032E2F27E1SG
Intel

IC SOC FPGA 240 I/O 672FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 320K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
package: 672-BBGA, FCBGA
Voorraad5.680
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 320K Logic Elements
0°C ~ 100°C (TJ)
672-BBGA, FCBGA
672-FBGA (27x27)
10AS066N3F40I2LG
Intel

IC SOC FPGA 588 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
package: 1517-BBGA, FCBGA
Voorraad4.192
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 660K Logic Elements
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
10AS022C4U19I3SG
Intel

484-PIN UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 220K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
package: -
Voorraad4.992
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 220K Logic Elements
-40°C ~ 100°C (TJ)
-
-
5CSEBA2U19A7N
Intel

IC FPGA 161 I/O 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 700MHz
  • Primary Attributes: FPGA - 25K Logic Elements
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-FBGA
  • Supplier Device Package: 484-UBGA (19x19)
package: 484-FBGA
Voorraad2.400
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
700MHz
FPGA - 25K Logic Elements
-40°C ~ 125°C (TJ)
484-FBGA
484-UBGA (19x19)
BCM3384ZCSD01
Broadcom Limited

24X8 DOCSIS 3.0 MODEM

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
package: -
Voorraad6.464
-
-
-
-
-
-
-
-
-
-
MPFS025TLS-FCVG484I
Microchip Technology

IC SOC RISC-V 484FBGA

  • Architecture: MPU, FPGA
  • Core Processor: RISC-V
  • Flash Size: 128KB
  • RAM Size: 230.4KB
  • Peripherals: DMA, PCI, PWM
  • Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
  • Speed: -
  • Primary Attributes: FPGA - 23K Logic Modules
  • Operating Temperature: -40°C ~ 100°C
  • Package / Case: 484-BFBGA
  • Supplier Device Package: 484-FBGA (19x19)
package: -
Voorraad21
RISC-V
128KB
230.4KB
DMA, PCI, PWM
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
-
FPGA - 23K Logic Modules
-40°C ~ 100°C
484-BFBGA
484-FBGA (19x19)
AGID019R31B2I3V
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
package: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.9M Logic Elements
-40°C ~ 100°C (TJ)
3184-BFBGA Exposed Pad
3184-BGA (56x45)
AGFA008R16A2E3E
Intel

IC FPGA AGILEX-F 1546FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 764K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
package: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 764K Logic Elements
0°C ~ 100°C (TJ)
-
-
AGFB006R24C3E3E
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 573K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
package: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 573K Logic Elements
0°C ~ 100°C (TJ)
-
-
AGFB023R24C2E3E
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
package: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.3M Logic Elements
0°C ~ 100°C (TJ)
2340-BFBGA Exposed Pad
2340-BGA (45x42)
AGFA027R24C2I3V
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
package: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.7M Logic Elements
-40°C ~ 100°C (TJ)
-
-
XCVC1902-2LLIVSVA2197
AMD

IC VERSAL AICORE FPGA 2197BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 450MHz, 1.08GHz
  • Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2197-BFBGA, FCBGA
  • Supplier Device Package: 2197-FCBGA (45x45)
package: -
Request a Quote
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
-
256KB
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
450MHz, 1.08GHz
Versal™ AI Core FPGA, 1.9M Logic Cells
-40°C ~ 100°C (TJ)
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
1SX065HH3F35I3XG
Intel

IC FPGA STRATIX10SX 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 650K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
package: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 650K Logic Elements
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
AGIC040R39A1E1VB
Intel

IC FPGA AGILEX-I 3948FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 4.047M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3948-BFBGA Exposed Pad
  • Supplier Device Package: 3948-BGA (56x56)
package: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 4.047M Logic Elements
0°C ~ 100°C (TJ)
3948-BFBGA Exposed Pad
3948-BGA (56x56)
1SX040HH3F35E3VG
Intel

IC FPGA STRATIX10SX 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 400K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
package: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 400K Logic Elements
0°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
MPFS095TS-FCVG784I
Microchip Technology

IC SOC RISC-V 784BGA

  • Architecture: MPU, FPGA
  • Core Processor: RISC-V
  • Flash Size: 128kB
  • RAM Size: 857.6kB
  • Peripherals: DMA, PCI, PWM
  • Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
  • Speed: -
  • Primary Attributes: FPGA - 93K Logic Modules
  • Operating Temperature: -40°C ~ 100°C
  • Package / Case: 784-BGA
  • Supplier Device Package: 784-BGA
package: -
Voorraad9
RISC-V
128kB
857.6kB
DMA, PCI, PWM
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
-
FPGA - 93K Logic Modules
-40°C ~ 100°C
784-BGA
784-BGA
BCM3384DUKFSBGB0T
Broadcom Limited

CABLE MODEM

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
package: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
XCZU1CG-2SFVC784I
AMD

IC ZUP MPSOC CG A53 FPGA 784BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: -
  • Speed: 533MHz, 1.333GHz
  • Primary Attributes: -
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BFBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
package: -
Voorraad30
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
-
256KB
DMA, WDT
-
533MHz, 1.333GHz
-
-40°C ~ 100°C (TJ)
784-BFBGA, FCBGA
784-FCBGA (23x23)
1SX110HN3F43E2LG
Intel

IC FPGA STRATIX 10 1760FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 1100K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
package: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 1100K Logic Elements
0°C ~ 100°C (TJ)
1760-BBGA, FCBGA
1760-FBGA (42.5x42.5)
XCVC1802-2MLEVSVD1760
AMD

IC VERSAL AICORE FPGA 1760BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.4GHz
  • Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BFBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (40x40)
package: -
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
-
256KB
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
Versal™ AI Core FPGA, 1.5M Logic Cells
0°C ~ 100°C (TJ)
1760-BFBGA, FCBGA
1760-FCBGA (40x40)