Pagina 33 - Embedded - Microcontroller, Microprocessor, FPGA-modules | Geïntegreerde schakelingen (IC's) | Heisener Electronics
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Embedded - Microcontroller, Microprocessor, FPGA-modules

Archief 1.650
Pagina  33/59
Afbeelding
Onderdeelnummer
Fabrikant
Omschrijving
package
Voorraad
Aantal
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
TE0741-02-160-2C1
Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

  • Module/Board Type: FPGA
  • Core Processor: Kintex-7 160T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
package: -
Voorraad4.000
Kintex-7 160T
-
200MHz
32MB
-
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
SOMDM3730-31-1880AKIR
Logic

SYSTEM ON MODULE WIRELESS TORP

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM? Cortex?-A8, DM3730
  • Co-Processor: TMS320C64x (DSP)
  • Speed: 800MHz
  • Flash Size: 512MB
  • RAM Size: 512MB
  • Connector Type: Board-to-Board (BTB) Socket - 200
  • Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Voorraad5.568
ARM? Cortex?-A8, DM3730
TMS320C64x (DSP)
800MHz
512MB
512MB
Board-to-Board (BTB) Socket - 200
0.59" x 1.3" (15mm x 33mm)
-40°C ~ 85°C
SOMOMAP3503-10-1670HFCR
Logic

SYSTEM ON MODULE LV OMAP3503

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, OMAP3503
  • Co-Processor: -
  • Speed: 600MHz
  • Flash Size: 256MB
  • RAM Size: 128MB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
  • Operating Temperature: 0°C ~ 70°C
package: -
Voorraad6.752
ARM? Cortex?-A8, OMAP3503
-
600MHz
256MB
128MB
Board-to-Board (BTB) Socket - 480
1.23" x 3.01" (31.2mm x 76.5mm)
0°C ~ 70°C
101-1007
Digi International

MODULE POWERCORE FLEX 3810

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 25.8MHz
  • Flash Size: 512KB
  • RAM Size: 256KB
  • Connector Type: IDC Header 2x25, 2x5, 1x3mm
  • Size / Dimension: 2.35" x 4" (60mm x 102mm)
  • Operating Temperature: -40°C ~ 70°C
package: -
Voorraad4.272
Rabbit 3000
-
25.8MHz
512KB
256KB
IDC Header 2x25, 2x5, 1x3mm
2.35" x 4" (60mm x 102mm)
-40°C ~ 70°C
FS-335
Digi International

MODULE MOD520C 2MB FLASH

  • Module/Board Type: MCU Core
  • Core Processor: ElanSC520
  • Co-Processor: -
  • Speed: 133MHz
  • Flash Size: 2MB
  • RAM Size: 16MB
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: 0°C ~ 70°C
package: -
Voorraad7.040
ElanSC520
-
133MHz
2MB
16MB
-
-
0°C ~ 70°C
CENGPXA270-416-11-505HXR
Logic

CARD ENGINE 64MB SDRAM

  • Module/Board Type: MCU Core
  • Core Processor: PXA270
  • Co-Processor: -
  • Speed: 416MHz
  • Flash Size: 64MB
  • RAM Size: 64MB
  • Connector Type: Edge Connector
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: -25°C ~ 85°C
package: -
Voorraad2.048
PXA270
-
416MHz
64MB
64MB
Edge Connector
2.37" x 2.67" (60.2mm x 67.8mm)
-25°C ~ 85°C
TE0715-04-30-1I3
Trenz Electronic GmbH

XILINX ZYNQ Z-7030 SOC MICROMODU

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7030)
  • Speed: 125MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Voorraad5.872
ARM Cortex-A9
Zynq-7000 (Z-7030)
125MHz
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
TMP5704457BZWTQQ1
Texas Instruments

MODULE TMP5704457

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
package: -
Voorraad5.488
-
-
-
-
-
-
-
-
CC-9U-T724-Z1
Digi International

MODULE 9U 32MB SDRAM 16MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
package: -
Voorraad3.952
-
-
-
-
-
-
-
-
DC-EM-02T-S
Digi International

EM 8MB SDRAM 4MB FLASH SINGLE

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Voorraad2.960
ARM7TDMI, NS7520
-
55MHz
4MB
8MB
RJ45
1.94" x 1.58" (49.2mm x 40.0mm)
-40°C ~ 85°C
TE0715-04-30-1I
Trenz Electronic GmbH

SOM ZYNQ XC7Z030-1I 1GB DDR3

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7030)
  • Speed: 125MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Voorraad4.832
ARM Cortex-A9
Zynq-7000 (Z-7030)
125MHz
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
20-101-1319
Digi International

MINCORE MODULE RCM6710

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 6000
  • Co-Processor: -
  • Speed: 162.5MHz
  • Flash Size: 1MB
  • RAM Size: 1.032MB
  • Connector Type: Edge Connector - 52
  • Size / Dimension: 1.2" x 2" (30mm x 51mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Voorraad17.820
Rabbit 6000
-
162.5MHz
1MB
1.032MB
Edge Connector - 52
1.2" x 2" (30mm x 51mm)
-40°C ~ 85°C
XPDNC2000-01
Lantronix, Inc.

XPORT DIRECT PLUS DEVICE NETWORK

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
package: -
Voorraad7.568
-
-
-
-
-
-
-
-
TE0820-03-03EG-1ED
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
  • Operating Temperature: 0°C ~ 80°C
package: -
Voorraad5.808
Zynq UltraScale+ XCZU3EG-1SFVC784E
-
-
128MB
2GB
B2B
1.57" x 1.97" (40mm x 50mm)
0°C ~ 80°C
TE0803-02-04EV-1EA
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: 0°C ~ 85°C
package: -
Voorraad4.144
Zynq UltraScale+ XCZU4EV-1SFVC784E
-
-
128MB
2GB
B2B
2.05" x 2.99" (52mm x 76mm)
0°C ~ 85°C
TE0803-02-04EG-1EA
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: 0°C ~ 85°C
package: -
Voorraad7.424
Zynq UltraScale+ XCZU4EG-1SFVC784E
-
-
128MB
2GB
B2B
2.05" x 2.99" (52mm x 76mm)
0°C ~ 85°C
MYC-CZU4EV-V2-4E4D-1200-I
MYIR Tech Limited

MYC-CZU4EV-V2 CPU Module

  • Module/Board Type: MCU, Ethernet Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I
  • Speed: 2.4GHz
  • Flash Size: 4GB eMMC, 128MB QSPI
  • RAM Size: 4GB
  • Connector Type: Pin(s)
  • Size / Dimension: 2.362" L x 2.047" W (60.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I
2.4GHz
4GB eMMC, 128MB QSPI
4GB
Pin(s)
2.362" L x 2.047" W (60.00mm x 52.00mm)
-40°C ~ 85°C
TE0803-03-5DI21-A
Trenz Electronic GmbH

MODULE SOM TE0803-03

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
package: -
Request a Quote
-
-
-
-
-
-
-
-
MA-MA3-C6-7I-D10-R2
Enclustra FPGA Solutions

SOM CYCLONE V 5CSXFC6 1GB

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Cortex®-A9, Cyclone V SX/SE
  • Co-Processor: Cypress FX3 USB 3.0
  • Speed: 800MHz
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: 200 Pin
  • Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Voorraad9
ARM® Cortex®-A9, Cyclone V SX/SE
Cypress FX3 USB 3.0
800MHz
64MB
1GB
200 Pin
2.660" L x 1.180" W (67.60mm x 30.00mm)
-40°C ~ 85°C
TE0714-04-52I-8-A
Trenz Electronic GmbH

IC MODULE ARTIX-7

  • Module/Board Type: FPGA
  • Core Processor: Artix-7 A50T
  • Co-Processor: Artix-7
  • Speed: -
  • Flash Size: 16MB
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Request a Quote
Artix-7 A50T
Artix-7
-
16MB
-
-
1.570" L x 1.180" W (40.00mm x 30.00mm)
-40°C ~ 85°C
TE0820-04-4BI21KL
Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
package: -
Request a Quote
-
-
-
-
-
-
-
-
TE0807-03-5AI21-A
Trenz Electronic GmbH

MPSOC ZYNQ USCALE 4GB DDR4

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
package: -
Request a Quote
-
-
-
-
-
-
-
-
CC-WST-DW69-NM
Digi

STM32MP157DUAL GPU 512M SLC NAND

  • Module/Board Type: MPU
  • Core Processor: STM32MP157C
  • Co-Processor: Arm® Dual Cortex®-A7, ARM® Cortex®-M4
  • Speed: 650MHz, 209MHz
  • Flash Size: 512MB (Boot)
  • RAM Size: 512MB
  • Connector Type: Pin(s)
  • Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Request a Quote
STM32MP157C
Arm® Dual Cortex®-A7, ARM® Cortex®-M4
650MHz, 209MHz
512MB (Boot)
512MB
Pin(s)
1.142" L x 1.142" W (29.00mm x 29.00mm)
-40°C ~ 85°C
ME-SA2-D6-7I-D11-R1
Enclustra FPGA Solutions

SOM CYCLONE V 5CSTFD6 2GB

  • Module/Board Type: FPGA Core
  • Core Processor: ARM® Dual-Core Cortex-A9
  • Co-Processor: -
  • Speed: 800MHz
  • Flash Size: 64MB
  • RAM Size: 2GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Voorraad57
ARM® Dual-Core Cortex-A9
-
800MHz
64MB
2GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
-40°C ~ 85°C
TE0729-02-62I63MAK
Trenz Electronic GmbH

IC SOC MODULE ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 512MB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
32MB
512MB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C
AM0010-02-4DE21MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ ZU4EV
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
package: -
Request a Quote
Zynq™ UltraScale+™ ZU4EV
-
-
128MB
4GB
Board-to-Board (BTB) Socket
2.220" L x 1.575" W (56.40mm x 40.00mm)
0°C ~ 85°C
ME-XU7-15EG-2I-D12E-R4-1
Enclustra FPGA Solutions

SOM ZYNQ XU7 US+ ZU15EG

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: -
  • Speed: 533MHz, 1.333GHz
  • Flash Size: 16GB
  • RAM Size: 4GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
package: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
-
533MHz, 1.333GHz
16GB
4GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
-40°C ~ 85°C
ME-XU1-15EG-1E-D12E-G1-R4-2
Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: -
  • Speed: 600MHz, 1.5GHz
  • Flash Size: 16GB
  • RAM Size: 4GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: 0°C ~ 85°C
package: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
-
600MHz, 1.5GHz
16GB
4GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
0°C ~ 85°C