Afbeelding |
Onderdeelnummer |
Fabrikant |
Omschrijving |
package |
Voorraad |
Aantal |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Amphenol FCI |
CONN SOCKET SIP 4POS GOLD
|
package: - |
Voorraad7.668 |
|
4 (1 x 4) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
|
TE Connectivity AMP Connectors |
CONN SOCKET SIP 15POS TIN
|
package: - |
Voorraad8.352 |
|
15 (1 x 15) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
|
Assmann WSW Components |
CONN SOCKET PLCC 32POS GOLD
|
package: - |
Voorraad7.254 |
|
32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
|
|
Preci-Dip |
BGA SURFACE MOUNT 1.27MM
|
package: - |
Voorraad2.952 |
|
652 (35 x 35) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
package: - |
Voorraad2.664 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
|
|
|
Preci-Dip |
BGA PIN ADAPTER 1.27MM SMD
|
package: - |
Voorraad3.276 |
|
478 (26 x 26) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
|
Preci-Dip |
BGA PIN ADAPTER 1.27MM SMD
|
package: - |
Voorraad6.012 |
|
356 (26 x 26) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
|
package: - |
Voorraad6.786 |
|
24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 30POS TIN
|
package: - |
Voorraad7.020 |
|
30 (1 x 30) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
|
package: - |
Voorraad4.986 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 22POS GOLD
|
package: - |
Voorraad8.550 |
|
22 (2 x 11) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 22POS GOLD
|
package: - |
Voorraad2.124 |
|
22 (2 x 11) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 61POS GOLD
|
package: - |
Voorraad5.976 |
|
61 (1 x 61) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 9POS TIN
|
package: - |
Voorraad5.724 |
|
9 (1 x 9) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 1POS GOLD
|
package: - |
Voorraad3.490 |
|
1 (1 x 1) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
package: - |
Voorraad4.716 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 26POS GOLD
|
package: - |
Voorraad2.250 |
|
26 (1 x 26) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 18POS TIN
|
package: - |
Voorraad8.460 |
|
18 (2 x 9) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
|
Preci-Dip |
CONN SOCKET PGA 88POS GOLD
|
package: - |
Voorraad8.208 |
|
88 (12 x 12) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 4POS TIN
|
package: - |
Voorraad3.906 |
|
4 (1 x 4) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
Preci-Dip |
CONN IC DIP SOCKET 16POS GOLD
|
package: - |
Voorraad5.058 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 1POS GOLD
|
package: - |
Voorraad6.606 |
|
1 (1 x 1) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
Preci-Dip |
CONN IC DIP SOCKET 28POS GOLD
|
package: - |
Voorraad8.694 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
|
CNC Tech |
CONN IC DIP SOCKET 20POS GOLD
|
package: - |
Voorraad4.914 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
|
|
Preci-Dip |
CONN IC DIP SOCKET 20POS GOLD
|
package: - |
Voorraad8.172 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
package: - |
Voorraad6.678 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
3M |
CONN IC DIP SOCKET ZIF 32POS GLD
|
package: - |
Voorraad5.796 |
|
32 (2 x 16) | 0.070" (1.78mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
Assmann WSW Components |
CONN IC DIP SOCKET 16POS GOLD
|
package: - |
Voorraad22.332 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
