Pagina 41 - Aries Electronics Producten | Heisener Electronics
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Aries Electronics Producten

Archief 5.390
Pagina  41/193
Afbeelding
Onderdeelnummer
Fabrikant
Omschrijving
package
Voorraad
Aantal
32-6551-18
Aries Electronics

CONN IC DIP SOCKET ZIF 32POS

  • Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Nickel Boron
  • Contact Finish Thickness - Mating: 50µin (1.27µm)
  • Contact Material - Mating: Beryllium Nickel
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Nickel Boron
  • Contact Finish Thickness - Post: 50µin (1.27µm)
  • Contact Material - Post: Beryllium Nickel
  • Housing Material: Polyetheretherketone (PEEK), Glass Filled
  • Operating Temperature: -55°C ~ 250°C
package: -
Voorraad3.834
172-PLS16002-12
Aries Electronics

CONN SOCKET PGA ZIF GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -65°C ~ 125°C
package: -
Voorraad6.534
76-PLS19033-12
Aries Electronics

CONN SOCKET PGA ZIF GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -65°C ~ 125°C
package: -
Voorraad5.598
108-PLS12005-12
Aries Electronics

CONN SOCKET PGA ZIF GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -65°C ~ 125°C
package: -
Voorraad3.654
40-0501-31
Aries Electronics

CONN SOCKET SIP 40POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 40 (1 x 40)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
package: -
Voorraad6.948
40-6501-21
Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
package: -
Voorraad2.106
30-6823-90
Aries Electronics

CONN IC DIP SOCKET 30POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 30 (2 x 15)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole, Right Angle, Horizontal
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -
package: -
Voorraad6.588
27-7530-10
Aries Electronics

CONN SOCKET SIP 27POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 27 (1 x 27)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
package: -
Voorraad6.768
24-8300-310C
Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame, Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
package: -
Voorraad5.202
24-8190-610C
Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame, Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
package: -
Voorraad5.814
50-9518-10M
Aries Electronics

CONN IC DIP SOCKET 50POS GOLD

  • Type: DIP, 0.9" (22.86mm) Row Spacing
  • Number of Positions or Pins (Grid): 50 (2 x 25)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
package: -
Voorraad2.484
22-7XXXX-10
Aries Electronics

CONN SOCKET SIP 22POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 22 (1 x 22)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
package: -
Voorraad2.160
28-6501-31
Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
package: -
Voorraad4.464
14-6823-90
Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 14 (2 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole, Right Angle, Horizontal
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -
package: -
Voorraad6.534
18-6503-20
Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
package: -
Voorraad6.822
40-6501-30
Aries Electronics

CONN IC DIP SOCKET 40POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
package: -
Voorraad8.280
20-3518-112
Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
package: -
Voorraad7.884
32-0518-11
Aries Electronics

CONN SOCKET SIP 32POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 32 (1 x 32)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
package: -
Voorraad7.884
40-0518-10T
Aries Electronics

CONN SOCKET SIP 40POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 40 (1 x 40)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
package: -
Voorraad5.922
12-3513-10H
Aries Electronics

CONN IC DIP SOCKET 12POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 12 (2 x 6)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
package: -
Voorraad5.148
08-2820-90T
Aries Electronics

CONN IC DIP SOCKET 8POS TIN

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 8 (2 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole, Right Angle, Horizontal
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -
package: -
Voorraad8.856
10-2810-90T
Aries Electronics

CONN IC DIP SOCKET 10POS TIN

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 10 (2 x 5)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole, Right Angle, Vertical
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -
package: -
Voorraad41.598
68-652000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 68
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
package: -
Voorraad7.398
34-6625-21
Aries Electronics

625 DIP HDR SCRW MACH CONTACT

  • Connector Type: DIP, DIL - Header
  • Contact Type: Post
  • Number of Positions: 34
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 2
  • Row Spacing: 0.600" (15.24mm)
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
package: -
Voorraad3.942
38-6625-20
Aries Electronics

625 DIP HDR SCRW MACH CONTACT

  • Connector Type: DIP, DIL - Header
  • Contact Type: Post
  • Number of Positions: 38
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 2
  • Row Spacing: 0.600" (15.24mm)
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Tin
  • Contact Finish Thickness: 200µin (5.08µm)
  • Color: Black
package: -
Voorraad5.166
14-3625-31
Aries Electronics

625 DIP HDR SCRW MACH CONTACT

  • Connector Type: DIP, DIL - Header
  • Contact Type: Solder Cup
  • Number of Positions: 14
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 2
  • Row Spacing: 0.300" (7.62mm)
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
package: -
Voorraad8.100
09-0600-11
Aries Electronics

0600 STRIP-LINE HDR COINED CNTCT

  • Connector Type: DIP, DIL - Header
  • Contact Type: Forked
  • Number of Positions: 9
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 1
  • Row Spacing: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
package: -
Voorraad5.022
02-600-11
Aries Electronics

600 DIP HDR COINED CONTACTS

  • Connector Type: DIP, DIL - Header
  • Contact Type: Forked
  • Number of Positions: 2
  • Pitch: -
  • Number of Rows: 2
  • Row Spacing: 0.300" (7.62mm)
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
package: -
Voorraad3.544