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Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS TIN
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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package: - |
Voorraad7.686 |
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Aries Electronics |
CONN SOCKET PGA GOLD
- Type: PGA
- Number of Positions or Pins (Grid): -
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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package: - |
Voorraad8.226 |
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Aries Electronics |
CONN SOCKET PGA GOLD
- Type: PGA
- Number of Positions or Pins (Grid): -
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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package: - |
Voorraad8.280 |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 44 (2 x 22)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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package: - |
Voorraad2.736 |
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Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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package: - |
Voorraad5.040 |
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Aries Electronics |
CONN IC DIP SOCKET 42POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 42 (2 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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package: - |
Voorraad7.812 |
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Aries Electronics |
CONN SOCKET SIP 29POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 29 (1 x 29)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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package: - |
Voorraad3.276 |
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Aries Electronics |
CONN SOCKET PGA GOLD
- Type: PGA
- Number of Positions or Pins (Grid): -
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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package: - |
Voorraad5.526 |
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Aries Electronics |
CONN SOCKET SIP 25POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 25 (1 x 25)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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package: - |
Voorraad8.316 |
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Aries Electronics |
CONN IC DIP SOCKET 12POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 12 (2 x 6)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole, Right Angle, Vertical
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -
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package: - |
Voorraad6.768 |
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Aries Electronics |
CONN IC DIP SOCKET 10POS TIN
- Type: DIP, 0.2" (5.08mm) Row Spacing
- Number of Positions or Pins (Grid): 10 (2 x 5)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole, Right Angle, Horizontal
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -
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package: - |
Voorraad5.454 |
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Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
- Type: DIP, 0.2" (5.08mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -55°C ~ 105°C
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package: - |
Voorraad3.582 |
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Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 14 (2 x 7)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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package: - |
Voorraad6.156 |
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Aries Electronics |
CONN IC DIP SOCKET 30POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 30 (2 x 15)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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package: - |
Voorraad6.894 |
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Aries Electronics |
CONN SOCKET SIP 16POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 16 (1 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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package: - |
Voorraad3.096 |
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Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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package: - |
Voorraad7.020 |
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Aries Electronics |
CONN SOCKET SIP 16POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 16 (1 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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package: - |
Voorraad2.880 |
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Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 18 (2 x 9)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole, Right Angle, Horizontal
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -
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package: - |
Voorraad7.680 |
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Aries Electronics |
SOCKET ADAPTER TQFP TO 48DIP 0.6
- Convert From (Adapter End): TQFP
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 48
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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package: - |
Voorraad7.830 |
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Aries Electronics |
SOCKET ADAPTER PLCC TO 68PGA
- Convert From (Adapter End): PLCC
- Convert To (Adapter End): PGA
- Number of Pins: 68
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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package: - |
Voorraad7.470 |
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Aries Electronics |
SOCKET ADAPTER SOIC TO 24DIP 0.3
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 24
- Pitch - Mating: -
- Contact Finish - Mating: Tin
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: Polyimide (PI)
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package: - |
Voorraad6.876 |
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Aries Electronics |
0625 PIN-LINE HDR SCRW MACH CONT
- Connector Type: DIP, DIL - Header
- Contact Type: Forked
- Number of Positions: 22
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Wire Wrap
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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package: - |
Voorraad8.352 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Solder Cup
- Number of Positions: 32
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.900" (22.86mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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package: - |
Voorraad7.614 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 26
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.600" (15.24mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin
- Contact Finish Thickness: 200µin (5.08µm)
- Color: Black
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package: - |
Voorraad7.200 |
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Aries Electronics |
0625 PIN-LINE HDR SCRW MACH CONT
- Connector Type: Header Strip
- Contact Type: Post
- Number of Positions: 4
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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package: - |
Voorraad2.304 |
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Aries Electronics |
680 PROGRAM HEADERS/COVERS
- Connector Type: Header
- Contact Type: Male Pin
- Number of Positions: 12
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.300" (7.62mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: Programmable
- Contact Finish: Tin
- Contact Finish Thickness: 50µin (1.27µm)
- Color: Black
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package: - |
Voorraad4.698 |
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Aries Electronics |
0600 STRIP-LINE HDR COINED CNTCT
- Connector Type: DIP, DIL - Header
- Contact Type: Forked
- Number of Positions: 8
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin
- Contact Finish Thickness: 200µin (5.08µm)
- Color: Black
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package: - |
Voorraad3.366 |
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Aries Electronics |
CONN COVER HEADER 8POS
- Accessory Type: Cap (Cover)
- Number of Positions: 8
- For Use With/Related Products: 680 Series
- Features: -
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package: - |
Voorraad3.528 |
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